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Three Dimensional Simulation of Filling Process for Stacked-Chip Scale Packages

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Advanced Engineering for Processes and Technologies

Part of the book series: Advanced Structured Materials ((STRUCTMAT,volume 102))

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Abstract

Encapsulation is one of the key processes in electronic packaging in order to protect the integrated circuit chips from environmental and mechanical damages. The most obvious choice for the encapsulation process is transfer moulding due to its capability to mould small parts with complex features. An electronic package that employs transfer moulding is Stacked-Chip Scale Package (S-CSP). However, a computer simulation is one of the tools that could be used to simulate and predict the mould process. It is highly desirable in order to avoid the typical time-consuming procedure of mould design and process optimization by trial and error. In this paper, a fully three-dimensional analysis to predict the transfer moulding process of S-CSP encapsulation using a finite volume method (FVM) based software, FLUENT is presented. The proposed FVM simulation model is built and meshed using GAMBIT. Some simplification is done for the simulation model due to time consumption and the complicated geometry of the actual S-CSP model. In the analysis, the volume of fluid (VOF) technique was used to track the flow front of the encapsulation. The viscosity versus shear rate is plotted and the void formation problem is also discussed. The numerical results are compared with the previous experimental results and are in good agreement.

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Author information

Authors and Affiliations

  1. Universiti Kuala Lumpur, Malaysan Spanish Institute, Kulim Hi-Tech Park, 09000, Kulim, Kedah, Malaysia

    Mior Firdaus Mior Abd Majid, Mohamad Sabri Mohamad Sidik, Muhamad Husaini Abu Bakar, Khairul Shahril Shafee, Zainal Nazri Mohd Yusuf & Mohamad Shukri Mohd Zain

  2. School of Mechanical and Aerospace Engineering, Universiti Sains Malaysia, Engineering Campus, Seri Ampangan, 14300, Nibong Tebal, Seberang Perai Selatan, Pulau Pinang, Malaysia

    Mohd. Zulkifly Abdullah

Authors
  1. Mior Firdaus Mior Abd Majid
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  2. Mohamad Sabri Mohamad Sidik
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  3. Muhamad Husaini Abu Bakar
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  4. Khairul Shahril Shafee
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  5. Zainal Nazri Mohd Yusuf
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  6. Mohamad Shukri Mohd Zain
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  7. Mohd. Zulkifly Abdullah
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Correspondence to Mior Firdaus Mior Abd Majid .

Editor information

Editors and Affiliations

  1. Malaysian Institute of Marine Engineering Technology, Universiti Kuala Lumpur, Lumut, Perak, Malaysia

    Azman Ismail

  2. Malaysian Spanish Institute, Universiti Kuala Lumpur, Kulim, Kedah, Malaysia

    Muhamad Husaini Abu Bakar

  3. Faculty of Mechanical Engineering, Esslingen University of Applied Sciences, Esslingen am Neckar, Baden-Württemberg, Germany

    Andreas Öchsner

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Mior Abd Majid, M.F. et al. (2019). Three Dimensional Simulation of Filling Process for Stacked-Chip Scale Packages. In: Ismail, A., Abu Bakar, M., Öchsner, A. (eds) Advanced Engineering for Processes and Technologies. Advanced Structured Materials, vol 102. Springer, Cham. https://doi.org/10.1007/978-3-030-05621-6_1

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  • DOI: https://doi.org/10.1007/978-3-030-05621-6_1

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  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-030-05620-9

  • Online ISBN: 978-3-030-05621-6

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