Abstract
Most contamination control technology considers generalized and often unidentified particulate material as the major contaminant, but there are many situations in which gases, chemical films, microbiological materials, environment physical conditions, and unusual ambient energy levels are hazardous to the well-being of the products. This variety of contaminants can degrade product quality at least as seriously as can particulate contaminants. In fact, as particle removal and control methods improve, contaminating gases and vapors become a major problem area. However, their sources can be different than the particle sources, their transport and deposition mechanisms are different, their interaction with products and their control and/or removal procedures are different, and their spatial and temporal distributions in the manufacturing and processing environment are usually different from that of particulate contamination.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
References
Blitshteyn, M., & Martinez, A. M., 1986. Electrostatic-Charge Generation on Wafer Surfaces and Its Effect on Particulate Deposition. Microcontamination 4(11):55–61.
Burkman, D. C, et al., 1988. Understanding and Specifying the Sources and Effects of Surface Contamination in Semiconductor Processing. Microcontamination 6(11):57–62, 107, 110.
Cooper, D. W., et al., 1988. Deposition of Submicron Aerosol Particles during Integrated Circuit Manufacturing: Theory. Proceedings of the 9th International Committee of Contamination Control Societies Conference, pp. 19–26, September 26, 1988, Los Angeles.
Frey, A. H., 1986. Reduction of Formaldehyde, Ammonia, SO2, and CO2 Concentrations in Room Air. Journal of Environmental Science 29(4):57–59.
Harper, J., & Bailey, L., 1984. Flexible Material Handling Automation in Wafer Fabrication. Solid State Technology 27(7):89–98.
Librizzi, J., and Manna, R. R., 1983. Controlling Air Pollution from Semiconductor Fabrication Operations. Microelectronics Manufacturing and Testing 6(12):46–48.
Liu, B. Y. H., et al., 1987. Aerosol Charging and Neutralization and Electrostatic Discharge in Clean Rooms. Journal of Environmental Science 30(2):42–46.
McMahon, R., 1989. Monitoring Hazardous High-Purity Gases Used in Semiconductor Fabrication. Microelectronics Manufacturing and Testing 12(4):8–10.
Ohmi, T., Inaba, H., & Takenama, T., 1989. Preventing Electromagnetic Interference Essential for ULSI E-Bearn Performance. Microcontamination 7(11): 29–35.
Turner, T., 1983. Static in Wafer Fabrication Facility: Causes and Solutions. Semiconductor International 6(8): 122–126.
Whyte, W., 1968. Bacteriological Aspects of Air-Conditioning Plants. Journal of Hygiene 66:567.
Whyte, W., 1986. Sterility Assurance and Models for Assessing Airborne Bacterial Contamination. Journal of Parenteral Science and Technology 40(5): 188–197.
Rights and permissions
Copyright information
© 1992 Van Nostrand Reinhold
About this chapter
Cite this chapter
Lieberman, A. (1992). Gaseous, Chemical, and Other Contaminant Descriptions. In: Contamination Control and Cleanrooms. Springer, Boston, MA. https://doi.org/10.1007/978-1-4684-6512-9_4
Download citation
DOI: https://doi.org/10.1007/978-1-4684-6512-9_4
Publisher Name: Springer, Boston, MA
Print ISBN: 978-1-4684-6514-3
Online ISBN: 978-1-4684-6512-9
eBook Packages: Springer Book Archive