Abstract
Build-up printed wiring boards (build-up PWBs) are advanced forms of plated through hole printed wiring boards (PTH PWBs). Not only build-up PWBs but also PTH PWBs are based on the technologies used to achieve high density and multilayer PWBs, which are currently demanded. Build-up PWBs are considered to improve on the weak points of PTH PWBs. In order to achieve more advanced high density PWBs, progressive manufacturing technologies have been introduced. One of the most important technologies is filled via copper deposition, as mentioned in the previous chapters. The filled vias can be stacked on the vias in the lower layer, resulting in better electrical performance and greater wiring density than those achieved with conformal vias. Therefore the application of via filling is expanding. The details are described later in Sect. 9.7.3.
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Takagi, K., Okubo, T. (2014). Build-up Printed Wiring Boards (Build-up PWBs). In: Kondo, K., Akolkar, R., Barkey, D., Yokoi, M. (eds) Copper Electrodeposition for Nanofabrication of Electronics Devices. Nanostructure Science and Technology. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-9176-7_9
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DOI: https://doi.org/10.1007/978-1-4614-9176-7_9
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