Abstract
Recent years have shown an explosion in different LED–LCD displays, and a corresponding proliferation of LED TVs in the consumers’ living rooms. They offer a great picture, a great styling with a thin-form factor, increased functionality such as 3D and internet access, and great value for money. Likewise, the technical product design of LED–LCD TVs also made great strides in the past years. One of the key aspects of LED TV design is cooling of the LEDs, which also has evolved to cater for steadily increasing power densities in ever thinner product enclosures. In the lighting and computer industry, large finned heat sinks are used to address comparable thermal challenges. In the thin-form factor of a modern TV set, this is not feasible, and the only large surface areas available for cooling are located on the front and the back of the TV set. The role of in-plane heat spreading in LED–LCD thermal management has not been addressed so far. The scope of this subchapter is to clarify the thermal significance of heat spreading in the in-plane direction in the set, especially in relation to cost down initiatives using less LED packages at equal total light output.
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Notes
- 1.
According to IES RP-16-10 Nomenclature and Definitions for Illuminating Engineering, the quantity denoted by LE here is officially known as “luminous efficacy of radiant flux.” CIE S017/E:2011 ILV: International Lighting Vocabulary defines the same quantity under the name “luminous efficacy (of radiation).”
References
van Driel WD, Yuan CA, Koh S, Zhang GQ (2011) LED system reliability, thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (EuroSimE), 12th international conference on pp 1/5–5/5
Liu L, Yang D, Zhang GQ, You Z, Hou F, Liu D (2011) Thermal performance analysis of photoelectric parameters on high power led packaging modules, thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (EuroSimE), 12th international conference on, pp 1/5–5/5
Biber C (2008) LED light emission as a function of thermal conditions, semiconductor thermal measurement and management symposium, SEMI-THERM 2008. Twenty-fourth annual IEEE, pp 180–184
Lifetime behavior of LED systems (2011) Lumileds white paper WP15, www.philipslumileds.com/uploads/167/WP15-pdf. Accessed 24 Jan 2011
Koh S, Van Driel W, Zhang GQ (2011) Degradation of epoxy lens materials in led systems, thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (EuroSimE), 12th international conference on, pp 1/5–5/5
Barnhoefer U, Kim M-J, Erez M (2006) A low power passively cooled 2000 cd/m2 hybrid LED-LCD display, consumer electronics, 2006. ISCE ’06. IEEE tenth international symposium on, pp 1–4
Kim SK, Kang J, Kan WY, Kim SH (2010) Thermal characteristics of edge-illumination type led backlight system in a thin flat panel display, thermal and thermomechanical phenomena in electronic systems (ITherm), 12th IEEE intersociety conference on pp 1–5
Safety standard IEC60065 7th edition, audio, video and similar electronics apparatus
Luiten GA (2002) Cooling of a 32 inch plasma display monitor semiconductor thermal measurement and management symposium, SEMI-THERM 2002. 18th annual IEEE, pp 119–124
Luiten GA (2005) Fan control for a ceiling mount flat TV monitor, IEEE transactions on components and packaging technologies, vol 28, issue 4, pp 680–685
J Kahn S, Bar-Cohen A, Dessiatoun S, Ohadi M, Getz M, Norley J (2006) The impact of a thermal spreader on the temperature distribution in a plasma panel display, thermal and thermomechanical phenomena in electronics systems, ITHERM ’06. The tenth intersociety conference on, pp 395–401
Wilcoxon R, Cornelius D (2006) Thermal management of a LED light engine for airborne applications, semiconductor thermal measurement and management symposium, SEMI-THERM 2006 IEEE twenty-second annual IEEE, pp 178–185
http://www.cinemetrics.lv/database.php. Accessed 30 March 2010
http://live.philips.com/index.php/nl_be/video/bright-pro-2010-english/73378776001. Accessed 15 Oct. 2011
Luiten GA (2010) Characteristic length and cooling circle semiconductor thermal measurement and management symposium, SEMI-THERM 2010. 26th annual IEEE, pp 7–13
Ryoson H, Yajima T, Goto K, Hirata K, Oniki K (2010) Thermal performance of novel thin heatpipe, thermal and thermomechanical phenomena in electronics systems, ITHERM 2010 12th IEEE intersociety conference on, pp 1–7
FloTHERM® Electronics cooling CFD software. http://www.mentor.com/products/mechanical/products/flotherm. Accessed 15 Oct. 2011
Acknowledgments
A Thank-you to Philips TV innovation laboratory Eindhoven and Philips TV development site Bruges, whose ongoing support in TV-cooling activities is gratefully acknowledged.
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Luiten, G. (2014). Thermal Challenges in LED-Driven Display Technologies: State-of-the-Art. In: Lasance, C., Poppe, A. (eds) Thermal Management for LED Applications. Solid State Lighting Technology and Application Series, vol 2. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-5091-7_14
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DOI: https://doi.org/10.1007/978-1-4614-5091-7_14
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