Abstract
Some like it hot, others do not. And those others for sure include the designers of products that contain light-emitting diodes (LEDs). This book is about thermal management of LEDs and especially LED applications. The main question to be addressed is: Why do we need thermal management? As Belady put it eloquently in 2001 [Belady and Minichiello, Electronics Cooling Magazine, May issue, 2003]:
The ultimate goal of system thermal design is not the prediction of component temperatures, but rather the reduction of thermally associated risk to the product.
Hence, the objectives of a designer are not in the first place to calculate or measure temperatures, but to keep the lifetime beyond x years, to keep the color point within margin y, and to raise the efficiency to z %. And indeed, these objectives, determining the quality of LED-based products, are linked to the junction temperature. This is the main reason why a book on LED thermal management starts with an introductory chapter on LED reliability issues.
Parts of this chapter have been sourced from a chapter in a book on Solid State Lighting Reliability [Pecht and Chang, Solid state lighting reliability: components to systems, Springer, New York, pp. 43–110, 2013].
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Notes
- 1.
The color temperature of a white light is the temperature of an ideal Planckian black-body radiator that radiates a light of comparable hue to that light source. Thus, the color temperature of a white light of thermal radiation from an ideal black-body radiator is defined as equal to its surface temperature in kelvins. When the black-body radiator is heated to high temperatures, the heated black body emits the color, going from red, to orange, to yellow, to white, and finally to bluish white. The Planckian locus starts out in the red, then moves through the orange and yellow, and finally to the white region. The color temperature of a light source is regarded as the temperature of a Planckian black-body radiator that has the same chromaticity coordinates.
References
Belady C, Minichiello A (2003) Effective thermal design for electronic systems. Electronics Cooling Magazine 9(2):16–21. http://www.electronics-cooling.com/2003/05/effective-thermal-design-for-electronic-systems/
Pecht MG, Chang MH (2013) Failure mechanisms and reliability issues in LEDs. In: van Driel WD, Fan XJ (eds) Solid state lighting reliability: components to systems. Springer, New York, pp 43–110
Huang MS, Hung CC, Fang YC, Lai WC, Chen YL (2009) Optical design and optimization of light emitting diode automotive head light with digital micromirror device light emitting diode. Optik-Int J Light Electron Opt 121(10):1–9
Lee SWR, Lau CH, Chan SP, Ma KY, Ng MH, Ng YW, Lee KH, Lo JCC (2006) Development and prototyping of a HB-LED array module for indoor solid state lighting. High density microsystem design and packaging and component failure analysis, HDP’06, pp 141–145
Peon R, Doluweera G, Platonova I, Irvine-Halliday D, Irvine-Halliday G (2005) Solid state lighting for the developing world—the only solution. Optics & Photonics 2005, Proceedings of SPIE, vol 5941, pp 109–123, San Diego
Pinto RA, Cosetin MR, da Silva MF, Denardin GW, Fraytag J, Campos A, do Prado RN (2009) Compact emergency lamp using power LEDs. Industrial Electronics, 2009, IECON’09. 35th Annual Conference of IEEE pp 3494–3499
Shibata S-I, Oyabu T, Kimura H (2009) Bioelectric potential characteristic of pothos under light emitting diode. ICCAS-SICE pp 4663–4668
Krames MR, Shchekin OB, Mueller-Mach R, Mueller GO, Zhou L, Harbers G, Craford MG (2007) Status and future of high-power light-emitting diodes for solid-state lighting. J Disp Technol 3(2):160–175
Steigerwald DA, Bhat JC, Collins D, Fletcher RM, Holcomb MO, Ludowise MJ, Martin PS, Rudaz SL (2002) Illumination with solid state lighting technology. IEEE J Sel Top Quantum Electron 2:310–320
Steranka FM, Bhat J, Collins D, Cook L, Craford MG, Fletcher R, Gardner N, Grillot P, Goetz W, Keuper M, Khare R, Kim A, Krames M, Harbers G, Ludowise M, Martin PS, Misra M, Mueller G, Mueller-Mach R, Rudaz S, Shen YC, Steigerwald D, Stockman S, Subramanya S, Trottier T, Wierer JJ (2002) High power LEDs—technology status and market applications. Phys Status Solidi (a) 194(2):380–388
Schubert EF, Kim JK, Luo H, Xi J-Q (2006) Solid-state lighting-a benevolent technology. Rep Prog Phys 69(2):3069–3099
Aoyama Y, Yachi T (2008) An LED module array system designed for streetlight use. Energy 2030 Conference, 2008. Energy 2008. IEEE, pp 1–5
Vittori R, Scaburri A (2009) New solid state technologies and light emission diodes as a mean of control and lighting source applicable to explosion proof equipment, with the scope to reduce maintenance, to limit the risk of bad maintenance and to expand the plants’ life. PCIC Europe, 2009. Conference Record, pp 193–198
King M (2010) Characteristics of high brightness LEDs. Electronic Design Online Conference Series, session 5, 22 June, pp 1–16
Schubert EF (2006) Light-emitting diodes. 2nd edn. Chap. 18. Cambridge University Press, New York, pp 308–309
Wipiejewski T, Moriarty T, Hung V, Doyle P, Duggan G, Barrow D, McGarvey B, O’Gorman M, Calvert T, Maute M, Gerhardt V, Lambkin JD (2008) Gigabits in the home with plugless plastic optical fiber (POF) interconnects. Electronics System-Integration Technology Conference (ESTC), 2008. 2nd, pp 1263–1266
Chang YN, Hung CC, Tung SC (2009) Auto mixed light for RGB LED backlight module, Industrial Electronics, 2009. ISIE 2009. IEEE International Symposium, pp 864–869
Cree (2009) Cree Xlamp XR Family LED Reliability, CLD-AP06 Rev. 7, Cree, Inc., pp 1–6. http://scn.cree.com/products/pdf/XLamp_Reliability.pdf
Nichia (2012) Specifications for White LED Model: NCSW119T-H3, Nichia STS-DA1-2296, Nichia Corporation, pp 1–16. http://www.nichia.co.jp/specification/en/product/led/NCSW119-H3-E.pdf
Chang M-H, Das D, Varde PV, Pecht M (2012) Light emitting diodes reliability review. Microelectron Reliab 52(5):762–782
Bar-Cohen A, Kraus AD (1998) Advances in thermal modeling of electronic components and systems, vol 4. ASME Press
Gao S, Hong J, Shin S, Lee Y, Choi S, Yi S (2008) Design optimization on the heat transfer and mechanical reliability of high brightness light emitting diodes (HBLED) package. Electronic Components and Technology Conference (ECTC), 2008. 58th, pp 798–803
Jayasinghe L, Gu Y, Narendran N (2006) Characterization of thermal resistance coefficient of high-power LEDs. 6th International Conference on Solid State Lighting, Proceedings of SPIE, pp 1–10
Gu Y, Narendran N, (2004) A non-contact method for determining junction temperature of phosphor-converted white LEDs. Third International Conference on Solid State Lighting, Proceedings of SPIE 5187, pp 107–114
Sanawiratne J, Zhao W, Detchprohm T, Chatterjee A, Li Y, Zhu M, Xia Y, Plawsky JL (2008) Junction temperature analysis in green light emitting diode dies on sapphire and GaN Substrates. Phys Status Solidi (c) 5(6):2247–2249
Chhajed S, Xi Y, Li Y-L, Gessmann Th., and Schubert EF (2005) Influence of junction temperature on chromaticity and color-rendering properties of trichromatic white-light sources based on light-emitting diodes. J Appl Phys 97:054506–054508
Chen ZZ, Liu P, Qi SL, Lin L, Pan HP, QinZ. X, Yu TJ, He ZK, Zhang GY (2007) Junction temperature and reliability of high-power flip-chip light emitting diodes. Mat Sci Semicon Proc 10:206–210
Liu J, Tam WS, Wong H, Filip V (2009) Temperature-dependent light-emitting characteristics of InGaN/GaN Diodes. Microelectron Reliab 49:38–41
Peng L-H, Chuang C-W, Lou L-H (1999) Piezoelectric effects in the optical properties of strained InGaN quantum wells. Appl Phys Lett 74(6):795–797
JEDEC JESD51–51 standard Implementation of the electrical test method for the measurement of the real thermal resistance and impedance of light-emitting diodes with exposed cooling surface. http://www.jedec.org/sites/default/files/docs/JESD51-51_1.pdf
Poppe A, Molnár G, Csuti P, Szabó F, Schanda J. Aging of LEDs: a comprehensive study based on the LM80 standard and thermal transient measurements, CIE 27th Session-Proceedings, CIE 197:2011: (Vol 1, Part 1–2). Sun City, South-Africa, 10–15 July 2011. pp 467–477. Paper OP57. (ISBN: 978 3 901906 99 2)
Poppe A, Molnár G, Temesvölgyi T Temperature dependent thermal resistance in power LED assemblies and a way to cope with it. In: Proceedings of the 26th IEEE Semiconductor Thermal Measurement and Manage-ment Symposium (SEMI-THERM’10), 21–25 February 2010, Santa Clara, USA, pp 283–288. (ISBN: 978-1-4244-6458-1)
Lasance CJM, Poppe A (2009) Challenges in LED thermal characterization. 10th International Conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems, EuroSimE 2009 pp 1–11, Delft
Lasance CJM, Poppe A (2009) On the standardization of thermal characterisation of LEDs. Pro1647 ceedings of the 25th IEEE semiconductor thermal measurement and management symposium 1648 (SEMI-THERM’09), 15–19 March 2009, San Jose, USA, pp 151–158
Poppe A, Lasance CJM (2008) On the Standardisation of thermal characterisation of LEDs Part II: Problem Definition and Potential Solutions, THERMINIC 2008, Rome, Italy, pp 213–219
Poppe A, Lasance CJM (2009) Hot topic for LEDs: standardization issues of thermal characterization. Light and lighting, Conference with special emphasis on LEDs and Solid State Lighting, Budapest, Hungary, CIE, pp 43–46. May
Lasance CJM (2003) Thermally driven reliability issues in microelectronic systems: status-quo and challenges. Microelectron Reliab 43:1969–1974
Joshi Y, Azar K, Blackburn D, Lasance CJM, Mahajan R, Rantala J (2003) How well can we assess thermally driven reliability issues in electronic systems today? Summary of panel held at the THERMINIC 2002. Microelectron J 34(12):1195–1201
Lasance CJM (2008) Ten years of boundary-condition-independent compact thermal modeling of electronic parts: a review. Heat Transf Eng 29:149–168
Lasance CJM (2002) The Conceivable Accuracy of Experimental and Numerical Thermal Analyzes of Electronic Systems’. IEEE CPT 25:366–382
Lasance CJM (2001) The European project PROFIT: prediction of temperature gradients influencing the quality of electronic products. In: Proceedings of the 17th IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM’01), SanJose, USA, 20–22 March 2001, pp 120–125
JEDEC JESD51–50 standard Overview of methodologies for the thermal measurement of single-and multi-chip, single-and multi-PN-junction light-emitting diodes (LEDs). http://www.jedec.org/sites/default/files/docs/JESD51-50_1.pdf
JEDEC JESD51-52 standard Guidelines for combining CIE 127-2007 total flux measurements with thermal measurements of LEDs with exposed cooling surface. http://www.jedec.org/sites/default/files/docs/JESD51-52_1.pdf
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Pecht, M., Das, D., Chang, MH. (2014). Introduction to LED Thermal Management and Reliability. In: Lasance, C., Poppe, A. (eds) Thermal Management for LED Applications. Solid State Lighting Technology and Application Series, vol 2. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-5091-7_1
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