Abstract
Aluminum silicon carbide (AlSiC) is a metal-matrix composite consisting of an aluminum matrix with silicon carbide particles. It has a relatively high thermal conductivity (166–255 W/mK), and its thermal expansion can be adjusted to match that of other materials, e.g., silicon and gallium arsenide chips and various ceramics. AlSiC composites are suitable replacements for copper-molybdenum (CuMo) and copper-tungsten (CuW) composite materials as heat sinks, where the application requires lower weight. AlSiC has about one-third the weight of copper, one-fourth that of CuMo, and one-sixth that of CuW. AlSiC is also stronger and stiffer than copper. Currently it is used as a heat sink for power electronics (e.g., IGBTs), heat spreaders, housings for electronics, and lids for chips, e.g., microprocessors and ASICs. This chapter serves as an introduction to AlSiC materials, covers its basic fabrication methods, and reviews its applications in microelectronics packaging.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
References
Zweben C (2006) Thermal materials solve power electronics challenges. Power Electr Technol 32:40
Occhionero MA, Hay RA, Adams RW, Fennessy KP Aluminum silicon carbide (AlSiC) for cost-effective thermal management and functional microelectronic packaging design solutions. http://cpstechnologies.wsiefusion.net/pdf/cpseuro992.pdf
Surappa MK (2003) Aluminium matrix composites: challenges and opportunities. Sadhana 28:319–334
Lloyd DJ (1999) Particle reinforced aluminium and magnesium matrix composites. Int Mater Rev 39:1–23
Surappa MK, Rohatgi PK (1981) Preparation and properties of aluminium alloy ceramic particle composites. J Mater Sci 16:983–993
Molina JM, Saravanan RA, Arpon R, Garcia-Cordovilla C, Louis E, Narciso J (2001) Pressure infiltration of liquid aluminium into packed ceramic particulate with a bimodal size distribution. Trans JWRI 30(Special Issue):449–454, Join Weld Res Inst Osaka University
Segurado J, Gonzáles C, Llorca J (2003) A numerical investigation of the effect of particle clustering on the mechanical properties of composites. Acta Mater 51:2355–2369
Deng X, Chawla N (2006) Modeling the effect of particle clustering on the mechanical behavior of SiC particle reinforced Al matrix composites. J Mater Sci 41:5731–5734
Lloyd DJ (1991) Aspects of fracture in particulate reinforced metal matrix composites. Acta Metall Mater 39(1):59–71
Nair SV, Tien JK, Bates RC (1985) SiC reinforced aluminium metal matrix composites. Int Met Rev 30(6):275–290
Youssef YM, Dashwood RJ, Lee PD (2005) Effect of clustering on particle pushing and solidification behavior in TiB2 reinforced aluminium PMMCs. Compos Part A 36:747–763
Falk ML, Langer JS (1998) Dynamics of viscoplastic deformation in amorphous solids. Phys Rev E 57:7192–7205
Schuh CA, Lund AC (2003) Atomistic basis for the plastic yield criterion of metallic glass. Nat Mater 2:449–452
Mayr SG (2006) Activation energy of shear transformation zones - a key for understanding rheology of glasses and liquids. Phys Rev Lett 97:195501
Tzamtzis S, Barekar NS, Hari Babu N, Patel J, Dhindaw BK, Fan Z (2009) Processing of advanced AlSiC particulate metal matrix composites under intensive shearing – a novel Rheo process. Compos Part A: Appl Sci Manuf 40(2):144–151
S Qu, Geng L, Han J (2007) SiCp/Al Composites Fabricated by Modified Squeeze. J Mater Sci Technol 23(5)
Tiana J, Piñerob E, Narciso J, Louis E (2005) Effects of temperature on pressure infiltration of liquid Al and Al–12 wt% Si alloy into packed SiC particles. Scripta Materialia 53(12):1483–1488
Hopkins DC, Kellerman DW, Wunderlich RA, Basaran C, Gomez J (2006) High-temperature, high-density packaging of a 60 kW converter for >200 °C embedded operation. In: Applied power electronics conference and exposition, 2006. APEC ‘06. 21st Annual IEEE, 19–23 Mar 2006
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
Copyright information
© 2013 Springer Science+Business Media New York
About this chapter
Cite this chapter
Jiang, G., Diao, L., Kuang, K. (2013). AlSiC Thermal Management Materials. In: Advanced Thermal Management Materials. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-1963-1_8
Download citation
DOI: https://doi.org/10.1007/978-1-4614-1963-1_8
Published:
Publisher Name: Springer, New York, NY
Print ISBN: 978-1-4614-1962-4
Online ISBN: 978-1-4614-1963-1
eBook Packages: EnergyEnergy (R0)