Abstract
High-velocity compaction (HVC) is a production technique that uses a high-speed punch motion on powder materials to achieve superior mechanical properties. However, as the particle size of the powder metals decreases, achieving higher-density numbers becomes increasingly challenging. For this reason, the HVC technique cannot be adopted for manufacturing W85-Cu heat sinks as the particle size of the tungsten powder is very fine (FSSS 3 μm or finer). In this study, the HVC process at elevated temperatures is studied for W85-Cu heat sinks (HTHVC). Tungsten skeletons prepared by conventional uniaxial methods are compacted by the HTHVC method at various elevated temperatures. The compacted tungsten skeletal blanks are infiltrated with copper at an elevated temperature of 1,350 °C for 2h. The mechanical properties including density, thermal conductivity, hermeticity, and coefficient of thermal expansion, have been found to be in line with the requirements for W85-Cu heat sinks.
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References
Huang P (1982) Principles of powder metallurgy. Metallurgical Industry Press, Beijing, pp 169–275
Chi Y, Guo S, Meng F, Xia Y, Heng Z, Dong L (2005) High-velocity pressing compaction technology of powder metallurgy. Powder Metall Ind 15(6):41–45
Barendvanden B, Christer F, Tomas L (2006) Industrial implementation of high velocity compaction for improved properties. Powder Metall 49(2):107–109
Jonsén P, Häggbladh HÅ, Troive L, Furuberg J, Allroth S, Skoglund P (2007) Green body behavior of high velocity pressed metal powder. Mater Sci Forum 534/536:289–292
Aslund C (2004) High velocity compaction (HVC) of stainless steelgas atomized powder[C]. In: Herbert D, Raimund R (eds) Euro PM 2004 conference proceedings, EPMA, Shrewsbury, pp 533–564
Bruska A, Bengt S, Leif K (2005) Development of a high-velocity compaction process for polymer powders. Polym Test 24(4):909–919
Jauffrès D, Lame O, Vigier G, Doré F (2007) Microstructural origin of physical and mechanical properties of ultra high molecular weight polyethylene processed by high velocity compaction. Polymer 48(21):6374–6383
Chen Z (2007) Modern powder metallurgy technology. Chemical Industry Press, Beijing, pp 326–328
German RM, Hons KF, Johnson JL (1994) Powder metallurgy processing of thermal management materials for microelectronic applications. Proc Int J Powder Metall 30(2):205–215
Zweben C (1998) Advances in composite materials for thermal management in electronic packaging. JOM 50(6):47–51
Crum S (1996) MCM substrate choices expand. Proc Electr Pack Prod 36(4):47–49
Qiang Z, Dongli S (2000) Recent achievements in research for electronic packaging substrate materials. Proc Mater Sci Technol 8(4):66–69
Zhengchun L, Zhifa W, Guosheng J (2001) Advances in metal-matrix material for electronic packaging. Proc Ordnance Mat Sci Eng 02:70–73
Xuebing Y, Renjie W, Guoding Z (1994) Research and development on metal-matrix electronic packaging material. Proc Mater Rev 3:64–66
Zhifa W, Guosheng J, Zhengchun L (1998) Ultrapressure forming and low-temperature sintering of tungsten. Proc Rare Metal Mater Eng 27(5):290–293
Guosheng J, Zhifa W, Hong W (2007) Study on control of pores in W-skeleton in preparing W-15Cu composite. Powder Metall Technol 25(2):126–128
Meifen L, Chaofei Z, Shukui L (2005) Effect of compressive deformation on microstructures and properties of infiltrated W-Cu composites. Proc Ordnance Mater Sci Eng 03:17–19
Zhengyun W, Daocheng L, Wei F (2007) Research of preparing W-Cu composites by high-energy ball milling. Proc Cemented Carbide 24(3):148–151
Skoglund P (2001) High density PM parts by high velocity compaction. Powder Metall 44(3):20–25
Richard F (2002) HVC punches PM to new mass production limits. Proc MPR 57(9):26–30
Hoganaos CE (2001) Promotes potential of high velocity compaction. Proc MPR 56(9):6–10
Zhou M, Rosakis AJ, Ravichandran G (1996) Dynamically propagating shear bands in impact loaded pre notched plates, Proc of experimental investigations of temperature signatures and propagation speed. Mech Phys Solid 44(6):981–1006
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Jiang, G., Diao, L., Kuang, K. (2013). Novel Methods for Manufacturing of W85-Cu Heat Sinks for Electronic Packaging Applications. In: Advanced Thermal Management Materials. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-1963-1_6
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DOI: https://doi.org/10.1007/978-1-4614-1963-1_6
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