Abstract
In this chapter, we will present the development of advanced thermal management materials. First, we will introduce one popular classification of thermal management materials. Next, we will present thermal management materials with an Al–Cu matrix and particle-enhanced materials such as W, Mo, SiC, AlN, BeO, Si, and others with a low coefficient of expansion. The materials covered include WCu, MoCu, AlSiC, Cu/SiC, Cu/Si, and negative thermal expansion materials. In the following section, we will introduce fiber-reinforced thermal management materials such as boron fibers, carbon fibers, Al2O3 fibers, and SiC fibers. The development of a Cu–Cf composite and aluminum graphite materials is presented. Finally, copper/molybdenum/copper (CMC), copper/molybdenum–copper/copper (CPC), and Cu/Invar/Cu (CIC) materials are introduced.
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Jiang, G., Diao, L., Kuang, K. (2013). Development of Advanced Thermal Management Materials. In: Advanced Thermal Management Materials. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-1963-1_4
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DOI: https://doi.org/10.1007/978-1-4614-1963-1_4
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