Abstract
A broad range of studies is introduced to emphasize the diverse capabilities of moiré interferometry. This work was performed during the last several years at six different photomechanics laboratories. They are at the Idaho National Engineering Laboratory (INEL), University of Strathclyde, University of Washington, Rockwell Science Center, IBM Corporation and Virginia Polytechnic Institute and State University (VPI&SU).
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References
J. S. Epstein, S. M. Graham, K. E. Perry and W. G. Reuter, “Displacement and Strain Fields for a Bimetallic Strip Under Remote Tension,” J. Applied Mechanics, ASME (submitted for publication).
S. A. Chavez, V. A. Deason and J. S. Epstein, “Use of Moiré Interferometry in Weldments,” Proc. Int. Conf. on Trends in Welding Research, S. A. David, editor, American Society for Metals, Metals Park, Ohio, pp. 533–537 (1986).
C. A. Walker, A. McDonach, P. MacKenzie and J. McKelvie, “Dynamic Moiré Measurement of Strains Induced in a Titanium Tube Plate During Rolling of a Series of Tubes,” Experimental Mechanics, Vol. 25, No. 1, pp. 1–5 (1985).
A. McDonach, J. McKelvie and C. A. Walker, “Stress Analysis of Fibrous Composites using Moiré Interferometry,” Optics and Lasers in Engineering, Vol. 1, No. 2, pp. 185–205 (1980).
D. Post, R. Czarnek and C. W. Smith, “Patterns of U and V Displacement Fields Around Cracks by Moiré Interferometry,” Application of Fracture Mechanics to Materials and Structures, G. C. Sih, E. Sommer and W. Dehl, editors, Martinus Nijhoff Publishers, Boston, pp. 699–708 (1984).
G. Nicoletto, “Moiré Interferometric Fringe Patterns about Crack Tips: Experimental Observations and Numerical Simulations,” Optics and Lasers in Engineering, Vol. 12, No. 2, pp. 135–150 (1990).
J. S. Epstein and M. S. Dadkhah, “Moiré Interferometry in Fracture Mechanics,” Experimental Techniques in Fracture, Vol. III, J. S. Epstein, editor, VHC Publishers, Inc., New York, pp. 427–508 (1993).
Z. K. Guo, “Experimental and Numerical Characterization of the Fracture Behavior of Quasi-brittle Materials,” Ph.D. Thesis, University of Washington, Seattle, Washington (1993).
M. S. Dadkhah and A. S. Kobayashi, “HRR Field of a Moving Crack, An Experimental Analysis,” Engineering Fracture Mechanics, Vol. 34, pp. 253–262 (1989).
C. A. Burger, “Photoelasticity,” Chap. 5, Handbook on Experimental Mechanics, 2nd edition, A. S. Kobayashi, editor, VCH Publishers, New York (1993).
D. Post, “Photoelasticity,” Chap. 6, Manual on Experimental Stress Analysis, 5th edition, J. F. Doyle and J. W. Philips, editors, Society for Experimental Mechanics, Bethel, Connecticut (1989).
C. W. Smith, “Use of Optical Methods in Stress Analysis of Three-Dimensional Cracked Body Problems,” Optical Engineering, Vol. 21, No. 4, pp. 696–703 (1982).
C. W. Smith, “Measurements of Three-dimensional Effects in Fracture Mechanics,” Fracture Mechanics, Vol. 19, ASTM STP 969, American Society for Testing and Materials, Philadelphia, pp. 5–18 (1988).
C. W. Smith and A. S. Kobayashi, “Experimental Fracture Mechanics,” Chap. 20, Handbook on Experimental Mechanics, 2nd edition, A. S. Kobayashi, editor, VCH Publishers, New York (1993).
V. A. Deason and M. B. Ward, “A Multipulsed Dynamic Diffraction Moiré Interferometer,” Laser Interferometry: Quantitative Analysis of Interferograms, Vol. 1162, pp. 46–53, SPIE, Bellingham, Washington (1989).
V. A. Deason, J. S. Epstein and M. Abdallah, “Dynamic Diffraction Moiré: Theory and Applications,” Optics and Lasers in Engineering, Vol. 12, No. 2, pp. 173–187 (1990).
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© 1994 Springer-Verlag New York, Inc.
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Post, D., Han, B., Ifju, P. (1994). Metallurgy, Fracture, Dynamic Loading. In: High Sensitivity Moiré. Mechanical Engineering Series. Springer, New York, NY. https://doi.org/10.1007/978-1-4612-4334-2_12
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DOI: https://doi.org/10.1007/978-1-4612-4334-2_12
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