Abstract
Piezoelectricity and longitudinal elastic wave propagation constitute the basic physical mechanisms involved in the classical bulk acoustic wave resonator. Innovative acoustic MEMS will rely on other types of elastic waves (shear waves, guided waves in free plates or plates bonded on substrate, waves in periodic media) or transduction mechanisms (electrostriction) which are described in the first section of this chapter. Operation and characteristics of emerging acoustic RF MEMS devices, such as shear and guided wave resonators, tunable resonators and phononic crystal-based resonators and filters, are reviewed in the other sections.
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Notes
- 1.
Surface acoustic wave (SAW) devices are not discussed in this chapter except in Sect. 4.3. SAW devices are generally not considered as MEMS for historical (first SAW devices were developed when MEMS technology did not exist) and technological (classical SAW devices require a piezoelectric substrate) reasons. This separation is less and less justified today, as current research in SAW, BAW and other acoustic RF MEMS devices converges.
- 2.
In this chapter, the term “elastic waves” is preferred to “acoustic waves” which is also associated to waves propagating in fluids. However, devices are still denoted as “acoustic RF MEMS devices” throughout the text as they are often designated by these terms in electrical engineering.
- 3.
The location of the resonance modes at β = 0 is given here for AlN. Their connection to S1 and S2 modes could be different in other materials.
- 4.
This case corresponds to a homogeneous medium treated as a periodic medium of period d. The dispersion curve is obtained by superposing homogeneous medium dispersion curves and their replication shifted by any integer (positive or negative) multiple of 2π ∕ d.
- 5.
Quality factors given in this chapter are in-air measured values at series frequency f s unless specified otherwise.
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Dubus, B. (2013). Future Trends in Acoustic RF MEMS Devices. In: Enz, C., Kaiser, A. (eds) MEMS-based Circuits and Systems for Wireless Communication. Integrated Circuits and Systems. Springer, Boston, MA. https://doi.org/10.1007/978-1-4419-8798-3_4
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