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Packaging

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Silicon Carbide Microsystems for Harsh Environments

Part of the book series: MEMS Reference Shelf ((MEMSRS,volume 22))

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Abstract

Packaging is typically required to provide some level of hermeticity to the sensor and electronics. Without this protection, the sensor or electronics performance would degrade or drift, aliasing the output characteristics and potentially leading to premature failure of the device. These issues are compounded for harsh environment applications. Highly corrosive media require highly corrosion resistant materials be used for packaging, limiting the available material set that can be used. High temperature environments increase the rate of corrosion and diffusion as well as can decrease fatigue life or may simply exceed the melting point or glass transition point of certain common packaging materials. It also can introduce significant internal stresses due to mismatch in thermal expansion rates of the various materials inside the package. High pressure and high shock environments additionally require components be properly sized or a different mechanical topology implemented so that they can survive the high mechanical forces encountered.

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Author information

Authors and Affiliations

  1. Automation & Robotics Research Institute, The University of Texas at Arlington, Arlington, Texas, USA

    Muthu B. J. Wijesundara

  2. Proteus Biomedical Inc., Redwood City, California, USA

    Robert G. Azevedo

Authors
  1. Muthu B. J. Wijesundara
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  2. Robert G. Azevedo
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Correspondence to Muthu B. J. Wijesundara .

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Wijesundara, M.B.J., Azevedo, R.G. (2011). Packaging. In: Silicon Carbide Microsystems for Harsh Environments. MEMS Reference Shelf, vol 22. Springer, New York, NY. https://doi.org/10.1007/978-1-4419-7121-0_5

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  • DOI: https://doi.org/10.1007/978-1-4419-7121-0_5

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  • Publisher Name: Springer, New York, NY

  • Print ISBN: 978-1-4419-7120-3

  • Online ISBN: 978-1-4419-7121-0

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