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Silicon Carbide Microsystems for Harsh Environments

Part of the book series: MEMS Reference Shelf ((MEMSRS,volume 22))

Abstract

Microsystems, or microelectromechanical systems (MEMS), technology continues to grow rapidly by enabling ever emerging applications that demand diverse, versatile functionality.Microsystems refers to a class of sub-millimeter scale sensors and actuators coupled with signal processing capable of measuring physical and chemical changes or performing desired physical and chemical functions. Microsystem technology based on micro-scale mechanical transducers progressed because silicon (Si) possesses both favorable electrical and mechanical properties to create these micro-sensor elements. Although many types of materials, ranging from ceramics to polymers, have been explored as platforms for microsystem technology, Si is currently the dominant platform. Si microsystems leverage the highly-parallel batch fabrication paradigm that has made microfabricated silicon-based semiconductor electronics commercially viable. Furthermore, they have benefited from a large body of knowledge around Si masking and etching techniques, which make fabrication of complicated geometries possible. This has enabled the current pervasiveness of silicon microsystems and components; they range from accelerometers for automotive airbags and inertial sensing, gyroscopes in video game controllers, micro-mirrors for projection displays, injector nozzles for inkjet printer cartridges, and mechanical timing references and RF filters for communication systems.

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Authors and Affiliations

  1. Automation & Robotics Research Institute, The University of Texas at Arlington, Arlington, Texas, USA

    Muthu B. J. Wijesundara

  2. Proteus Biomedical Inc., Redwood City, California, USA

    Robert G. Azevedo

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  1. Muthu B. J. Wijesundara
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  2. Robert G. Azevedo
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Correspondence to Muthu B. J. Wijesundara .

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Wijesundara, M.B.J., Azevedo, R.G. (2011). Introduction. In: Silicon Carbide Microsystems for Harsh Environments. MEMS Reference Shelf, vol 22. Springer, New York, NY. https://doi.org/10.1007/978-1-4419-7121-0_1

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  • DOI: https://doi.org/10.1007/978-1-4419-7121-0_1

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