Abstract
Contactless packaging refers to the concept of using capacitively coupled or inductively coupled structures to connect chips together. That is, to use them as the electrical interfaces for chip-to-package, package-to-socket, and board-to-board interfaces (i.e. connectors). Collectively, these techniques are referred to as “AC Coupled Interconnect,” (ACCI) referring to the lack of a DC connection. These concepts arise from the key realization that a DC connection is not needed to communicate high frequency digital data; a good AC connection suffices. In fact, many high speed chip-to-chip communication standards, such as FiberChannel and Ethernet, use DC blocking capacitors so that the transmitter and receiver do not have to share a common DC supply, making them hot-pluggable. The difference in ACCI is the realization that smaller values of capacitance can be used.
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Franzon, P. (2010). Use of AC Coupled Interconnect in Contactless Packaging. In: Ho, R., Drost, R. (eds) Coupled Data Communication Techniques for High-Performance and Low-Power Computing. Integrated Circuits and Systems, vol 0. Springer, Boston, MA. https://doi.org/10.1007/978-1-4419-6588-2_5
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