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Technology Trends: Past, Present, and Future

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Advanced Flip Chip Packaging

Abstract

Since the invention of flip chip technology by IBM about 40 years ago, there has been a continuous need for increased I/O density. More recently fine pitch technology is being enabled in Pb-free through Cu pillar and Sn–Ag solders. Stiffer Pb-free interconnection coupled with fragile low-k dielectric materials imposes a significant challenge on first level packaging. In response to increased number of interconnections and higher performance needs, additional technologies are emerging, such as the following: fine pitch flip chip (<60 μm pitch) interconnections, 3D with and without TSV’s, liquid phase connections, and bond-on line. This introductory chapter covers these technologies and sets the stage for current and future flip chip technologies discussed throughout the book.

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Author information

Authors and Affiliations

  1. IBM Corporation, New York, USA

    Eric Perfecto

  2. IBM Corporation, retired, New York, USA

    Kamalesh Srivastava

Authors
  1. Eric Perfecto
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  2. Kamalesh Srivastava
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Corresponding author

Correspondence to Eric Perfecto .

Editor information

Editors and Affiliations

  1. ASE Group, Chin 3rd Rd. 26, Kaohsiung, 81170, Taiwan R.O.C.

    Ho-Ming Tong

  2. ASE Group, Chin 3rd Rd. 26, Kaohsiung, 81170, Taiwan R.O.C.

    Yi-Shao Lai

  3. , Department of Engineering, The Chinese University of Hong Kong, Shatin, Hong Kong, SAR, NT, China, People's Republic

    C.P. Wong

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© 2013 Springer Science+Business Media New York

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Perfecto, E., Srivastava, K. (2013). Technology Trends: Past, Present, and Future. In: Tong, HM., Lai, YS., Wong, C. (eds) Advanced Flip Chip Packaging. Springer, Boston, MA. https://doi.org/10.1007/978-1-4419-5768-9_2

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  • DOI: https://doi.org/10.1007/978-1-4419-5768-9_2

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  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4419-5767-2

  • Online ISBN: 978-1-4419-5768-9

  • eBook Packages: EngineeringEngineering (R0)

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