Abstract
In recent years, 3-D microstructures have been utilized to realize high performance micro devices and systems in Micro Electro Mechanical Systems (MEMS) [1]. Silicon has been widely used in MEMS field and micro/nano fabrication methods based on photolithography have been developed. In the case of 3-D micro structures fabricated using bulk Si, the Deep Reactive Ion Etching (DeepRIE) as well as the conventional anisotropic wet etching using alkaline solutions are now commonly used. For high performance energy devices, downsizing and 3-D structuring are indispensable. Since fine metallization methods on 3-D microstructures are requested, the uniform photoresist coating over highly topographic surfaces is one of the key technologies. Electrodepositon of photoresist is also excelled in the formation of uniform photoresist coating on 3-D structures, but it can be applied only on a conductive layer [2]. For commonly used processes, spray coating method is advantageous in many cases.
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Shoji, S., Ishizuka, M., Sato, H., Arakawa, T., Mizuno, J. (2010). Micro/Nano Fabrication Technologies and Micro Flow Devices for Future Energy Devices. In: Osaka, T., Datta, M., Shacham-Diamand, Y. (eds) Electrochemical Nanotechnologies. Nanostructure Science and Technology. Springer, New York, NY. https://doi.org/10.1007/978-1-4419-1424-8_5
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DOI: https://doi.org/10.1007/978-1-4419-1424-8_5
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