Abstract
Ceramic multilayers are known as very universal PCB's and packages with advanced properties, 3-dimensional functionalities, good RF performance and integration of passives.
This is a preview of subscription content, log in via an institution to check access.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Abbreviations
- LTCC:
-
Low Temperature Co-fired Ceramics
- RF:
-
Radio Frequency(ies)
- PCB:
-
Printed circuit board
- NRE:
-
Non-recurring engineering
- CPW:
-
Coplanar waveguide
- RF-MEMS:
-
Radio Frequency-Micro ElectroMechanical System
- Ka:
-
Kurz above (from german) =27 to 40 GHz
- TCE:
-
Thermal Coefficient of Expansion
- DUT:
-
Device Under Test
- DC:
-
Direct Curent
- UV:
-
Ultra Violet
- W:
-
Watt
- PZT:
-
Lead Zirconate Titanate
References
Y. Imanaka, “Multilayered low temperature cofired ceramics ((LTCC) technology”, Springer 2005, ISBN 0-387-23130–7
C. Block et al., “LTCC technology for system-in-package solutions”, SiRF 2006, pp. 236 ff.
G. E. Oliver, “Designing with LTCC”, Advanced packaging 04/2007
DuPont™ 943 Design Kit, Design tools for the DuPont™ 943 low loss green tape material system, DuPont microcircuit materials 2004
T. Bartnitzek et al., “Ceramic systems-in-package for RF and microwave”, Proceedings of IMAPS ATW RF&Microwave, San Diego, September 16–18 2008
VIA electronic, Design rules, http://www.via-electronic.de, 2008
B. Heinemann, H. Ruecker, R. Barth et al. (2002). Novel collector design for high-speed SiGe:C HBTs. IEEE IEDM Tech Dig. Doi: 10.1109/IEDM.2002.1175953.
Hao li, Rein, H.-M., Suttorp, T., Bock, J. (2004). “Fully integrated SiGe VCOs with powerful output buffer for 77-GHz automotive Radar systems and applications around 100 GHz,” IEEE J. Solid-State Cir. Doi: 10.1109/JSSC.2004.833552.
Krems, Th., Haydl, W., Massler, H.,Ruediger, J (1996). “Millimeter-wave performance of chip interconnections using wire bonding and flip chip,” IEEE Intern. Microw. Symposium MTT-S. Doi: 10.1109/MWSYM.1996.508504.
P. Hallbjörner, M. Bergstrom, M. Boman, P., Lindberg, E. Öjefors, and A. Rydberg, “Millimetre-wave switched beam antenna using multiple travelling-wave patch arrays,” IEE Proc.-Microw. Antennas Propag., vol. 152, no. 6, pp. 551–555, December 2005.
G. M. Rebeiz, RF MEMS: Theory, design and technology. New York: Wiley, 2003.
Y.S. Bang et al., “Fabrication and characterization of RF MEMS package based on LTCC lid structure and AuSn eutectic bonding, Eurosensors, Lyon FR, June 2007
M. Reppel, Electromagnetic analysis of LTCC high frequency devices, Microwave Engineering Europe, July 2003, pp. 25–30
http://www.crc.gc.ca/en/html/crc/home/mediazone/eye_on_tech/2008/issue8/finland (VTT- CRC)
Acknowledgments
I would like to thank all colleaques in VIA electronic and the partners of the international project team RF-PLATFORM for the excellent cooperation. A special thank to the European Commission for the support of the project work in the 6th framework program, project number 027468 RF-Platform.
Author information
Authors and Affiliations
Corresponding author
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2010 Springer Science+Business Media, LLC
About this chapter
Cite this chapter
Bartnitzek, T., Gautier, W., Qu, G., Cheng, S., Ziaei, A. (2010). Ceramic Systems in Package for RF and Microwave. In: Kuang, K., Kim, F., Cahill, S. (eds) RF and Microwave Microelectronics Packaging. Springer, Boston, MA. https://doi.org/10.1007/978-1-4419-0984-8_7
Download citation
DOI: https://doi.org/10.1007/978-1-4419-0984-8_7
Published:
Publisher Name: Springer, Boston, MA
Print ISBN: 978-1-4419-0983-1
Online ISBN: 978-1-4419-0984-8
eBook Packages: EngineeringEngineering (R0)