Abstract
In order to enhance the reliability of a flip-chip on organic board package, underfill is usually used to redistribute the thermo-mechanical stress created by the Coefficient of Thermal Expansion (CTE) mismatch between the silicon chip and organic substrate. However, the conventional underfill relies on the capillary flow of the underfill material and has many disadvantages. In order to overcome these disadvantages, many variations have been invented to improve the flip-chip underfill process. This paper reviews the recent advances in the material design, process development, and reliability issues of flip-chip underfill, especially in no-flow underfill, molded underfill, and wafer-level underfill. The relationship between the materials, process and reliability in these packages is discussed.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
References
C.P. Wong, S. Lou, and Z. Zhang, “Flip the Chip”, Science, Vol. 290, p. 2269, Dec, 2000.
E. Davis, W. Harding, R. Schwartz, and J. Coring, “Solid Logic Technology: Verdatile High Performance Microelectronics”, IBM Journal of Research & Development, Vol. 8, p. 102, 1964.
F. Nakano, T. Soga, and S. Amagi, “Resin-Insertion Effect on Thermal Cycle Resistivity of Flip-Chip Mounted LSI Devices”, The Proceedings of the International Society of Hybrid Microelectronics Conference, p. 536, 1987.
Y. Tsukada, “Surface Laminar Circuit and Flip-Chip Attach Packaging”, Proceedings of the 42nd Electronic Components and Technology Conference, p. 22, 1992.
B. Han and Y.Guo, “Thermal Deformation Analysis of Various Electronic Packaging Products by Moire and Microscope Moire Interferometry”, Journal Electronic Packaging, Vol. 117, p. 185, 1995.
S. Han and K.K. Wang, “Analysis of the Flow of Encapsulant During Underfill Encapsulation of Flip-Chips”, IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B, Vol. 20, No. 4, pp. 424–433, 1997.
S. Han, K.K. Wang, and S.Y. Cho, “Experimental and Analytical Study on the Flow of Encapsulant During Underfill Encapsulation of Flip-Chips”, Proceedings of the 46th Electronic Components and Technology Conference, pp. 327–334, 1996.
L. Nguyen, C. Quentin, P. Fine, B. Cobb, S. Bayyuk, H. yang, and S.A. Bidstrup-Allen, “Underfill of Flip Chip on Laminates: Simulation and Validation”, IEEE Transactions on Components and Packaging Technology, Vol. 22, No. 2, pp. 168–176. 1999.
W.B. Young and W.L. Yang, “Underfill of Flip-Chip: The Effect of Contact Angle and Solder Bump Arrangement”, IEEE Transactions on Advanced Packaging, Vol. 29, No. 3, pp. 647–653, 2006.
H. Bressers, P. Beris, J. Caers, and J. Wondergerm, “Influence of Chemistry and Processing of Flip Chip Underfills on Reliability”, 2nd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Stockholm Sweden, 1996.
J.B. Nysaether, P. Lundstrom, and J. Liu, “Measurements of Solder Bump Lifetime as a Function of Underfill Material Properties”, IEEE Transactions on Components, Packaging and Manufacturing Technology, Part A, Vol. 21, No. 2, pp. 281–287, 1998.
R. Dudek, A. Schubert, and B. Michel, “Analyses of Flip Chip Attach Reliability”, Proceedings of 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing”, pp. 77–85, 2000.
P. Palaniappan, P. Selman, D. Baldwin, J. Wu, and C.P. Wong, “Correlation of Flip Chip Underfill Process Parameters and Material Properties with In-Process Stress Generation”, Proceedings of the 48th Electronic Components and Technology Conference, pp. 838–847, 1998.
L. Mercado and V. Sarihan, “Evaluation of Die Edge Cracking in Flip-Chip PBGA Packages”, IEEE Transactions on Components and Packaging Technologies, Vol. 26, No. 4, pp. 719–723, 2003.
S.P. Lahoti, S.C. Kallolimath, and J. Zhou, “Finite Element Analysis of Thermo-hygro-mechanical Failure of a Flip Chip Package”, Proceedings of IEEE 6th International Conference on Electronic Packaging Technology, 2005.
S. Luo and C.P. Wong, “Effect of Coupling Agents on Underfill Material in Flip Chip Packaging”, Proceedings of 2000 International Symposium on Advanced Packaging Materials, pp. 183–188, 2000.
T. Chen, J. Wang, and D. Lu, “Emerging Challenges of Underfill for Flip Chip Application”, Proceedings of the 54th Electronic Components and Technology Conference, pp. 175–179, 2004.
J.S. Hwang, “Lead-Free Solder: the Sn/Ag/Cu System”, Surface Mount Technology, p. 18, July 2000.
B. Huang and N.C. Lee, “Prospect of Lead Free Alternatives for Reflow Soldering”, Proceedings of SPIE – The International Society for Optical Engineering, Vol. 3906, p. 771, 1999.
A. Butterfield, V. Visintainer, and V. Goudarzi, “Lead-Free Solder Paste Flux Evaluation and Implementation in Personal Communication Devices”, Proceedings of the 50th Electronic Components and Technology Conference, p. 1420, 2000.
S. Mahalingam, K. Goray, and A. Joshi, “Design of Underfill Materials for Lead Free Flip Chip Application”, Proceedings of 2004 IEEE International Society Conference on Thermal Phenomena, pp. 473–479, 2004.
C.K. Chee, Y.T. Chin, T. Sterrett, Y. He, H.P. Sow, R. Manepali, and D. Chandran, “Lead-free Compatible Underfill Materials for Flip Chip Application”, Proceedings of the 52nd Electronic Components and Technology Conference, pp. 417–424, 2002.
P. Tsao, C. Huang, M. Li, B. Su, and N. Tsai, “Underfill Characterization for Low-k Dielectric/Cu Interconnect IC Flip-Chip Package Reliability”, Proceedings of the 54th IEEE Electronic Components and Technology Conference, pp. 767–769, 2004.
S. Rajagopalan, K. Desai, M. Todd, and G. Carson, “Underfill for Low-K Silicon Technology”, Proceedings of 2004 IEEE/SEMI International Electronics Manufacturing Technology Symposium, 2004.
R. Pennisi and M. Papageorge, “Adhesive and Encapsulant Material with Fluxing Properties”, U.S. Patent 5,128,746, (July 7, 1992).
C.P. Wong and D. Baldwin, “No-Flow Underfill for Flip-Chip Packages”, U.S. Patent Disclosure, April 1996.
C.P. Wong and S.H. Shi, “No-Flow Underfill of Epoxy Resin, Anhydride, Fluxing Agent and Surfactant”, U.S. Patent 6,180,696, (Jan. 30, 2001).
C.P. Wong, S.H. Shi, and G. Jefferson, “High Performance No Flow Underfills for Low-Cost Flip-Chip Applications”, Proceedings of the 47th Electronic Components and Technology Conference, p. 850, 1997.
C.P. Wong, S.H. Shi, and G. Jefferson, “High Performance No-Flow Underfills for Flip-Chip Applications: Material Characterization”, IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A: Packaging Technologies, Vol. 21, No. 3, p. 450, 1998.
Z. Zhang, S.H. Shi, and C.P. Wong, “Development of No-Flow Underfill Materials for Lead-Free Bumped Flip-Chip Applications”, IEEE Transaction on Components, and Packaging Technologies, Vol. 24, No. 1, pp. 59–66, (2000).
Z. Zhang and C.P. Wong, “Development of No-Flow Underfill for Lead-Free Bumped Flip-Chip Assemblies”, Proceedings of Electronics Packaging Technology Conference, pp. 234–240, Singapore, (2000).
Z. Zhang and C.P. Wong, “Study and Modeling of the Curing Behavior of No-Flow Underfill”, Proceedings of the 8th International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces, pp. 194–200, Stone Mountain, Georgia, (2002).
P. Morganelli and B. Wheelock, “Viscosity of a No-flow Underfill During Reflow and its Relationship to Solder Wetting”, Proceedings of the 51st Electronic Components and Technology Conference, pp. 163–166, 2001.
R.W. Johnson, M.A. Capote, S. Chu, L. Zhou, and B. Gao, “Reflow-Curable Polymer Fluxes for Flip Chip Encapsulation”, Proceedings of International Conference on Multichip Modules and High Density Packaging, 1998, pp. 41–46.
S.H. Shi and C.P. Wong, “Study of the Fluxing Agent Effects on the Properties of No-Flow Underfill Materials for Flip-Chip Applications”, Proceedings of the 48th Electronic Components and Technology Conference, p. 117, 1998.
S.H. Shi, D. Lu, and C.P. Wong, “Study on the Relationship Between the Surface Composition of Copper Pads and No-Flow Underfill Fluxing Capability”, Proceedings of the 5th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, p. 325, 1999.
S.H. Shi and C.P. Wong, “Study of the Fluxing Agent Effects on the Properties of No-Flow Underfill Materials for Flip-Chip Applications”, IEEE Transactions on Components and Packaging Technologies, Part A: Packaging Technologies, Vol. 22, No. 2, p. 141, June 1999.
P. Palm, K. Puhakka, J. Maattanen, T. Heimonen, and A. Tuominen, “Applicability of No-Flow Fluxing Encapsulants and Flip Chip Technology in Volume Production”, Proceedings of the 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, pp. 163–167, 2000.
K. Puhakka and J.K. Kivilahti, “High Density Flip Chip Interconnections Produced with In-situ Underfills and Compatible Solder Coatings”, Proceedings of the 3rd International Conference on Adhesives Joining and Coating Technology in Electronics Manufacturing, pp. 96–100, 1998.
T. Wang, T.H. Chew, Y.X. Chew, and Louis Foo, “Reliability Studies of Flip Chip Package with Reflowable Underfill”, Proceedings of the Pan Pacific Microelectronic Symposium, Kauai, Hawaii, February 2001, pp. 65–70.
Z. Zhang and C.P. Wong, “Assembly of Lead-Free Bumped Flip-Chip with No-Flow Underfills”, IEEE Transactions on Electronics Packaging Manufacturing, in publication.
D. Miller and D.F. Baldwin, “Effects of Substrate Design on Underfill Voiding Using the Low Cost, High Throughput Flip Chip Assembly Process”, Proceedings of the 7th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2001, pp. 51–56.
R. Zhao, R.W. Johnson, G. Jones, E. Yaeger, M. Konarski, P. Krug, and L. Crane, “Processing of Fluxing Underfills for Flip Chip-on-Laminate Assembly”, Presented at IPC SMEMA Council APEX 2002, Proceeding of APEX, San Diego, CA, pp. S18-1-1 – S18-1-7, 2002.
T. Wang, C. Lum, J. Kee, T.H. Chew, P. Miao, L. Foo, and C. Lin, “Studies on a Reflowable Underfill for Flip Chip Application”, Proceedings of the 50th Electronic Components and Technology Conference, pp. 323–329, 2000.
D. Gamota and C.M. Melton, “The Development of Reflowable Materials Systems to Integrate the Reflow and Underfill Dispensing Processes for DCA/FCOB Assembly”, IEEE Transactions on Components and Packaging Technologies, Part C, Vol. 20, No. 3, p. 183, July 1997.
X. Dai, M.V. Brillhart, M. Roesch, and P.S. Ho, “Adhesion and Toughening Mechanisms at Underfill Interfaces for Flip-Chip-on-Organic-Substrate Packaging”, IEEE Transactions on Components and Packaging Technologies, Vol. 23, No. 1, March 2000, pp. 117–127.
B.S. Smith, R. Thorpe, and D.F. Baldwin, “A Reliability and Failure Mode Analysis of No Flow Underfill Materials for Low Cost Flip Chip Assembly”, Proceedings of 50th Electronic Components & Technology Conference, 2000, pp. 1719–1730.
K.S. Moon, L. Fan, and C.P. Wong, “Study on the Effect of Toughening of No-Flow Underfill on Fillet Cracking”, Proceedings of the 51st Electronic Components and Technology Conference, 2001, pp. 167–173.
H. Wang and T. Tomaso, “Novel Single Pass Reflow Encapsulant for Flip Chip Application”, Proceedings of the 6th International Symposium on Advanced Packaging Materials: Process, Properties, and Interfaces, 2000, pp. 97–101.
Z. Zhang, L. Fan, and C.P. Wong, “Development of Environmental Friendly Non-Anhydride No-Flow Underfills”, IEEE Transactions on Components and Packaging Technologies, Vol. 25, No. 1, March 2002, pp. 140–147.
S.H. Shi, Q. Yao, J. Qu, and C.P. Wong, “Study on the Correlation of Flip-Chip Reliability with Mechanical Properties of No-Flow Underfill Materials”, Proceedings of the 6th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2000, pp. 271–277.
S.H. Shi, and C.P. Wong, “Recent Advances in the Development of No-Flow Underfill Encapsulants – a Practical Approach towards the Actual Manufacturing Application”, Proceedings of the 49th Electronic Components and Technology Conference, p. 770, 1999.
P. Miao, Y. Chew, T. Wang, and L. Foo, “Flip-Chip Assembly Development Via Modified Reflowable Underfill Process”, Proceedings of the 51st Electronic Components and Technology Conference, 2001, pp. 174–180.
S. Kawamoto, O. Suzuki, and Y. Abe, “The Effect of Filler on the Solder Connection for No-Flow Underfill”, Proceedings of the 56th Electronic Components and Technology Conference, 2006, pp. 479–484.
Z. Zhang, J. Lu, and C.P. Wong, Provisional Patent 60/288,246: “A Novel Process Approach to Incorporate Silica Filler into No-Flow Underfill”, 5-2-2001.
Z. Zhang, J. Lu, and C.P. Wong, “A Novel Approach for Incorporating Silica Fillers into No-Flow Underfill”, Proceedings of the 51st Electronic Components and Technology Conference, 2001, pp. 310–316.
Z. Zhang and C.P. Wong, “Novel Filled No-Flow Underfill Materials and Process”, Proceedings of the 8th International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces, 2002, pp. 201–209.
K.M. Gross, S. Hackett, D.G. Larkey, M.J. Scheultz, and W. Thompson, “New Materials for High Performance No-Flow Underfill”, Symposium Proceedings of IMAPS 2002, Denvor, September, 2002.
K. Gross, S. Hackett, W. Schultz, W. Thompson, Z. Zhang, L. Fan, and C.P. Wong, “Nanocomposite Underfills for Flip Chip Application”, Proceedings of the 53rd Electronic Components and Technology Conference, 2003, pp. 951–956.
Y. Sun, Z. Zhang, and C.P. Wong, “Fundamental Research on Surface Modification of Nano-Size Silica for Underfill Applications”, Proceedings of the 54th Electronic Components and Technology Conference, 2004, pp. 754–760.
P.O. Weber, “Chip Package with Molded Underfill”, U.S. Patent 6,038,136, (March 14, 2000).
P.O. Weber, “Chip Package with Transfer Mold Underfill”, U.S. Patent 6, 157,086, (December 5, 2000).
K. Gilleo, B. Cotterman, and T. Chen, “Molded Underfill for Flip Chip in Package”, High Density Interconnection, p. 28, June 2000.
T. Braun, K.F. Becker, M. Koch, V. Bader, R. Aschenbrenner, and H. Reichl, “Flip Chip Molding – Recent Progress in Flip Chip Encapsulation”, Proceedings of 8th International Advanced Packaging Materials Symposium, March, 2002, pp. 151–159.
F. Liu, Y.P. Wang, K. Chai, and T.D. Her, “Characterization of Molded Underfill Material for Flip Chip Ball Grid Array Packages”, Proceedings of the 51st Electronic Components and Technology Conference, 2001, pp. 288–292.
L.P. Rector, S. Gong, T.R. Miles, and K. Gaffney, “Transfer Molding Encapsulation of Flip Chip Array Packages”, IMAPS Proceedings, 2000, pp. 760–766.
S. Han and K.K. Wang, “Study on the Pressurized Underfill Encapsulation of Flip Chips”, IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, Vol. 20, N0. 4, pp. 434–442, 1999.
L.P. Rector, S. Gong, K. Gaffney, “On the Performance of Epoxy Molding Compounds for Flip Chip Transfer Molding Encapsulation”, Proceedings of the 51st Electronic Components and Technology Conference, 2001, pp. 293–297.
K.F. Becker, T. Braun, M. Koch, F. Ansorge, R. Aschenbrenner, and H. Reichl, “Advanced Flip Chip Encapsulation: Transfer Molding Process for Simultaneous Underfilling and Postencapsulation”, Proceedings of the 1st International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, 2001, pp. 130–139.
S.H. Shi, T. Yamashita, and C.P. Wong, “Development of the Wafer-Level Compressive-Flow Underfill Process and Its Required Materials”, Proceedings of the 49th Electronic Components and Technology Conference, p. 961, 1999.
S.H. Shi, T. Yamashita, and C.P. Wong, “Development of the Wafer-Level Compressive-Flow Underfill Encapsulant”, Proceedings of the 5th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, p. 337, 1999.
K. Gilleo and D. Blumel, “Transforming Flip Chip into CSP with Reworkable Wafer-Level Underfill”, Proceedings of the Pan Pacific Microelectronics Symposium, p. 159, 1999.
K. Gilleo, “Flip Chip with Integrated Flux, Mask and Underfill”, W.O. Patent 99/56312, (November 4, 1999).
J. Qi, P. Kulkarni, N. Yala, J. Danvir, M. Chason, R.W. Johnson, R. Zhao, L. Crane, M. Konarski, E. Yaeger, A. Torres, R. Tishkoff, and P. Krug, “Assembly of Flip Chips Utilizing Wafer Applied Underfill”, Presented at IPC SMEMA Council APEX 2002, Proceedings of APEX, San Diego, CA, pp. S18-3-1 – S18-3-7, 2002.
Q. Tong, B. Ma, E. Zhang, A. Savoca, L. Nguyen, C. Quentin, S. Lou, H, Li, L. Fan, and C.P. Wong, “Recent Advances on a Wafer-Level Flip Chip Packaging Process”, Proceedings of the 50th Electronic Components and Technology Conference, pp. 101–106, 2000.
S. Charles, M. Kropp, R. Kinney, S. Hackett, R. Zenner, F.B. Li, R. Mader, P. Hogerton, A. Chaudhuri, F. Stepniak, and M. Walsh, “Pre-Applied Underfill Adhesives for Flip Chip Attachment”, IMAPS Proceedings, International Symposium on Microelectronics, Baltimore, MD, 2001, pp. 178–183.
Z. Zhang, Y. Sun, L. Fan, and C.P. Wong, “Study on B-Stage Properties of Wafer Level Underfill”, Journal of Adhesion Science and Technology, Vol. 18, No. 3, pp. 361–380 (2004).
Z. Zhang, Y. Sun, L. Fan, R. Doraiswami, and C.P. Wong, “Development of Wafer Level Underfill Material and Process”, Proceedings of 5th Electronic Packaging Technology Conference, Singapore, pp. 194–198, December 2003.
R.L.D. Zenner and B.S. Carpenter, “Wafer-Applied Underfill Film Laminating”, Proceedings of the 8th International Symposium on Advanced Packaging Materials, pp. 317–325, 2002.
R.V. Burress, M.A. Capote, Y.-J. Lee, H.A. Lenos, and J.F. Zamora, “A Practical, Flip-Chip Multi-Layer Pre-Encapsulation Technology for Wafer-Scale Underfill”, Proceedings of the 51st Electronic Components and Technology Conference, pp. 777–781, 2001.
Y. Sun, Z. Zhang, and C.P. Wong, “Photo-Definable Nanocomposite for Wafer Level Packaging”, Proceedings of the 55th Electronic Components and Technology Conference, p. 179, 2005.
Author information
Authors and Affiliations
Corresponding author
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2009 Springer Science+Business Media, LLC
About this chapter
Cite this chapter
Zhang, Z., Wong, C.P. (2009). Flip-Chip Underfill: Materials, Process and Reliability. In: Lu, D., Wong, C. (eds) Materials for Advanced Packaging. Springer, Boston, MA. https://doi.org/10.1007/978-0-387-78219-5_9
Download citation
DOI: https://doi.org/10.1007/978-0-387-78219-5_9
Publisher Name: Springer, Boston, MA
Print ISBN: 978-0-387-78218-8
Online ISBN: 978-0-387-78219-5
eBook Packages: Chemistry and Materials ScienceChemistry and Material Science (R0)