Skip to main content
SpringerLink
Log in

Die Attach Adhesives and Films

  • Chapter
Materials for Advanced Packaging

Abstract

This chapter outlines the strong correlation between developments in electronic packaging technologies and required properties of die attach materials. An overview of die attach materials is summarized with the trends in the market. Die attach paste, adhesive tape for a lead on chip (LOC), die attach film, and the prospects of advanced die attach film are described in each section. The technical requirements of the die attach materials, which include high purity, fast curing, low stress and high package crack resistance are discussed.

Die attach films have become the main stream of die attach materials owing to their excellent properties and reliability. The future of advanced die attach films is explained with the introduction of adhesive film with dicing / die attach dual functionality.

The effects of adhesive properties such as peel strength and water absorption to improve package crack resistance are reported in detail. The development of die attach films with excellent reliability for advanced packages such as BGA/CSP is also reviewed.

This is a preview of subscription content, log in via an institution to check access.

Access this chapter

Log in via an institution
Chapter
USD 29.95
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
eBook
USD 149.00
Price excludes VAT (USA)
  • Available as EPUB and PDF
  • Read on any device
  • Instant download
  • Own it forever
Hardcover Book
USD 199.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Institutional subscriptions

References

  1. S. Kayama, M. Tanimoto, S. Uchida, H. Tsukada, T. Suto, “ASIC Packaging Technology Handbook”, Science Forum (1992)

    Google Scholar 

  2. E. Hagimoto, “CSP Technology”, Kogyochosakai (1997)

    Google Scholar 

  3. T. Kasuga, “CSP/BGA Technology”, Nikkankogyoshinbunsha (1998)

    Google Scholar 

  4. A. Dotani, “Semicon Japan 2003 Navigator”, Nikkei Microdevices, 49 (2003)

    Google Scholar 

  5. H. Asakura, Nikkei Microdevices, (4) 74 (1999)

    Google Scholar 

  6. K. Fujita, “Current Die Bonding Technology”, Proceedings of VLSI Assembly Technology Forum Part II, ISS Industrial Systems, 37 (1998)

    Google Scholar 

  7. K. Takahashi, SEMI Technology Symposium, 539 (2000)

    Google Scholar 

  8. D. Makino, N. Ichimura, K, Suzuki, Electronic Parts and Materials, 20(11), 69 (1981)

    Google Scholar 

  9. M. Yamazaki, “Die Bonding Technology for high performance of LSI Package”, Proceedings of LSI Assembly Technology Forum, ISS Industrial Systems, 37 (1996)

    Google Scholar 

  10. Y. Kanno, “Current Die Bonding Technology for Novel Package”, Proceedings of VLSI Assembly Technology Forum Part II, ISS Industrial Systems, 1 (1998)

    Google Scholar 

  11. I. Maekawa, Triceps, (12), 21 (1988)

    Google Scholar 

  12. G. Ito, Keikinzoku, Japan Institute of Light Metals, 18(3), 177 (1969)

    Google Scholar 

  13. J. C. Bolger, 14th National SAMP Technical Conference, October, 12 (1982)

    Google Scholar 

  14. J. C. Bolger, S. L. Morano, Adhesive Age, June, 17 (1984)

    Google Scholar 

  15. M. Harada, Gekkan Semiconductor World, (9), 119 (1992)

    Google Scholar 

  16. O. Kobayashi, Gekkan Semiconductor World, (5), 53 (1994)

    Google Scholar 

  17. S. Ishio, T. Maruyama, K. Miyata, Y. Soda, A. Namii, K. Toyozawa, K. Fujita, M. Kada, Technical Report of the Institute of Electronics, Information and Communication Engineers, ICD94-155 (11), 65 (1994)

    Google Scholar 

  18. K. Yamada, T. Dohdoh, Electronic Parts and Materials, (4), 93 (2007)

    Google Scholar 

  19. T. Uno, Gekkan Semiconductor World, (9), 114 (1992)

    Google Scholar 

  20. T. Kawamura, T. Suzuki, H. Sugimoto, N. Imai, M. Kzuya, Hitachi Cable, (12), 37 (1993)

    Google Scholar 

  21. W. M. Wasulko, A. G. Stauffer, Microelectric Manufacturing and Testing, 9 (1988)

    Google Scholar 

  22. Y. Akada, K. Nakamoto, K. Akazawa, Nitto Denko Technical Report, 29(2), 69 (1991)

    Google Scholar 

  23. S. Takeda, T. Masuko, M. Yusa, Y. Miyadera, “Die Bonding Adhesive Film”, Hitachi Chemical Technical Report, No. 24, 25 (Jan. 1995)

    Google Scholar 

  24. S. Takeda, T. Masuko, Y. Miyadera, M. Yamazaki, I. Maekawa, “A Novel Die Bonding Adhesive-Silver Filled Film”, Proceedings of 47th Electronic Components & Technology Conference (ECTC), May 18–21, 1997 San Jose, California, USA, 518 (1997)

    Google Scholar 

  25. M. Yasuda, Hitachi Chemical Technical Report, (40), 7 (2003)

    Google Scholar 

  26. T. Kato, M. Uruno, Seikei-Kakou, 12(5), 246 (2000)

    Google Scholar 

  27. T. Kato, O. Suwa, S. Fujii, M. Yamazaki, T. Masuko, Hitachi Chemical Technical Report, (43), 25 (2004)

    Google Scholar 

  28. R. Haruta, Journal of Japan Institute of Electronics Packaging, 10(5), 353 (2007)

    Google Scholar 

  29. S. Akejima, Journal of Japan Institute of Electronics Packaging, 10(5), 375 (2007)

    Google Scholar 

  30. T. Matsuzaki, T. Inada, K. Hatakeyama, Hitachi Chemical Technical Report, (46), 39 (2006)

    Google Scholar 

  31. K. Ebe, H. Senoo, O. Yamazaki, Journal of the Adhesion Society of Japan, 42(7), 280 (2006)

    Google Scholar 

  32. M. Harada, Gekkan Semiconductor World, (9), 119 (1992)

    Google Scholar 

  33. T. Yoshida, Gekkan Semiconductor World, (5), 72 (1994)

    Google Scholar 

  34. S. Ishio, T. Maruyama, K. Miyata, Y. Soda, A. Namii, K. Toyozawa, K. Fujita, M. Kada, Technical Report of the Institute of Electronics, Information and Communication Engineers, ICD94-155 (11), 65 (1994)

    Google Scholar 

  35. H. Li, A. Johnson, C. P. Wong, IEEE Transactions on Components and Packaging Technologies, 26(2), 466 (2003)

    Article  CAS  Google Scholar 

  36. A. K. S. Clair, T. L. S. Clair, Polymer Engineering and Science, 22(1), 9 (1982)

    Article  Google Scholar 

  37. D. Makino, “Recent Progress of the Application of Polyimides to Microelectronics”, pp. 380–402, Polymers for Microelectronics, Kodansha (1994)

    Google Scholar 

  38. D. Wilson, “Recent Advances in Polyimide Composites”, High Performance Polymers, 5, 77 (1993)

    Article  CAS  Google Scholar 

  39. F. W. Harris, M. W. Beltz, SAMPE Journal, 23, 6 (1987)

    CAS  Google Scholar 

  40. N. Furukawa, Y. Yamada, Y. Kimura, High Perfomance Polymers, 8, 617 (1996)

    Article  CAS  Google Scholar 

  41. J. L. Hedrick, H. R. Brown, W. Volksen, M. Sanchez, Polymer, 38(3), 605 (1997)

    Article  Google Scholar 

  42. L. Li, D. D. L. Chung, Composites, 22(3), 211 (1991)

    Article  Google Scholar 

  43. Y. Nakamura, Journal of the Adhesion Society of Japan, 38(11), 442 (2002)

    Google Scholar 

  44. K. Gaw, M. Kikei, M. Kakimoto, Y. Imai, Reactive and Functional Polymers, 30, 85 (1996)

    Article  CAS  Google Scholar 

  45. C. C. Su, E. M. Woo, Polymer, 36(15), 2883 (1995)

    Article  Google Scholar 

  46. M. Kimoto, Journal of the Adhesion Society of Japan 36(11), 456 (2000)

    Google Scholar 

  47. T. Masuko, S. Takeda, Journal of the Adhesion Society of Japan, 40(4), 136 (2004)

    Google Scholar 

  48. T. Masuko, S. Takeda, Journal of the Network Polymers of Japan, 25(4), 181 (2004)

    Google Scholar 

  49. A. Kawai, H. Nagata, M. Takata, Japan Journal of Applied Physics, 31, 1993 (1992)

    Article  Google Scholar 

  50. F. M. Fowkes, Industrial and Engineering Chemistry, 56, 40 (1964)

    Article  CAS  Google Scholar 

  51. M. Imoto, Journal of the Adhesion Society Of Japan, 26(1), 39 (1990)

    Google Scholar 

  52. T. Hata, T. Kitazaki, T. Saito, The Journal of Adhesion, 21, 177 (1987)

    Article  CAS  Google Scholar 

  53. R. A. Gledhill, A. J. Kinloch, The Journal of Adhesion, 6, 315 (1974)

    Article  CAS  Google Scholar 

  54. H. Yamabe, Journal of the Adhesion Society of Japan, 29(1), 12 (1993)

    CAS  Google Scholar 

  55. S. Takeda, T. Masuko, “Novel Die Attach Films Having High Reliability Performance for Lead-Free Solder and CSP” Proceedings of 50th Electronic Components and Technology Conference (ECTC), May 21–24, 2000, Las Vegas, Nevada, USA, p 1616 (2000)

    Google Scholar 

  56. T. Masuko, S. Takeda, Y. Hasegawa, Journal of Japan Institute of Electronics Packaging, 8(2), 116 (2005)

    Google Scholar 

  57. S. H. Hsiao, P. C. Huang, Journal of Polymer Research, 4(3), 183 (1997)

    Article  Google Scholar 

  58. R. F. Fedors, Polymer Engineering and Science, 14(2), 147 (1974)

    Article  Google Scholar 

  59. T. Okitsu, Secchaku, 40(8), 342 (1996)

    Google Scholar 

  60. J. C. Bolger, “Polyimide Adhesives to Reduce Thermal Stress in LSI Ceramic Packages”, 14th National SAMPE Technical Conference, October, pp. 257–266, (1982)

    Google Scholar 

Download references

Author information

Authors and Affiliations

  1. Research and Development Division, Hitachi Chemical Co., Ltd., 48 Wadai, Tsukuba, Ibaraki, 300-4247, Japan

    Shinji Takeda

Authors
  1. Shinji Takeda
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Takashi Masuko
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Shinji Takeda .

Editor information

Editors and Affiliations

  1. Henkel Locite Co., Ltd. Yantai, Shandong, P.R., China

    Daniel Lu

  2. Georgia Institute of Technology, Atlanta, GA, USA

    C.P. Wong

Rights and permissions

Reprints and permissions

Copyright information

© 2009 Springer Science+Business Media, LLC

About this chapter

Cite this chapter

Takeda, S., Masuko, T. (2009). Die Attach Adhesives and Films. In: Lu, D., Wong, C. (eds) Materials for Advanced Packaging. Springer, Boston, MA. https://doi.org/10.1007/978-0-387-78219-5_12

Download citation

Publish with us

Policies and ethics

Search

Navigation