Over the past decade, research in integrated circuit testing has broadened from digital test to include the testing of analog and mixed-signal devices. More recently, new test techniques for mixed-technology microelectromechanical systems (MEMS) are also receiving attention [1–5]. As MEMS rapidly evolve from single components to highly integrated systems for safety-critical applications, dependability is emerging as an important performance parameter. Fabrication techniques such as silicon micromachining lead to new types of manufacturing defects in MEMS [2]. Moreover, due to their underlying mixed technology and multiple energy domains (e.g., electric, mechanical, and fluidic), such composite microsystems exhibit failure mechanisms that are significantly different from those in electronic circuits. In fact, the 2003 International Technology Roadmap for Semiconductors (ITRS) recognizes the need for new test methods for disruptive device technologies that underly composite microsystems, and highlights it as one of the five difficult test challenges beyond 2009 [6].
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Su, F., Hwang, W., Mukherjee, A., Chakrabarty, K. (2008). Testing and Diagnosis of Realistic Defects in Digital Microfluidic Biochips. In: Tehranipoor, M. (eds) Emerging Nanotechnologies. Frontiers in Electronic Testing, vol 37. Springer, Boston, MA. https://doi.org/10.1007/978-0-387-74747-7_11
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