Global Interconnect Analysis

Conclusions

In this chapter we studied principles for system-level interconnect modeling. The main focus was to examine global wires that distribute signals between di erent system blocks. Additionally, power distribution was dealt with in the end of the chapter by using the maximum allowed power supply voltage variation as a constraint to design power distribution network in a proper way. We examined electrical properties of on-chip wires and discussed shortly some possible interconnect schemes in SoC and NoC. Some interconnect schemes in SoC and NoC were shortly discussed. We used Rent’s rule and multiple Rent’s exponents to evaluate cost functions that di erent system blocks set for the global wiring (both signal and power distribution). We optimized our signaling to achieve the maximum bandwidth, the minimum delay by using properly sized and placed repeaters and finally presented a joint optimization case study in which both power distribution and signal distribution in global wires were simultaneously optimized. Our analysis revealed that both early cost/performance estimation of resources (i.e. functional blocks) and the joint optimization of global signal and power estimation are essential when designing future SoCs and NoCs.