—In this paper, a built-in self-repair technique for the MEMS comb accelerometer device is proposed. The main device of the comb accelerometer consists of
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References
G. T. A. Kovacs, Micromachined Transducers Sourcebook, WCB/McGraw-Hill, New York, 1998.
URL: http://public.itrs.net.
K. Chakraborty and P. Mazumder, Fault-Tolerance and Reliability Techniques for High-Density RAMs, Prentice Hall, Upper Saddle River, NJ 07458, 2002.
B. Johnson, Design and Analysis of Fault Tolerant Digital Systems, Addison Wesley, 1989.
J. Ramirez-Angulo, and R. L. Geiger, ”New Laser-trimmed Film Resistor Structures for Very High Stability Requirements”, IEEE Transactions on Electron Devices, Vol. 35, Issue 4, pp. 516-518, Apr. 1988.
K. Tanaka, Y. Mochida, M. Sugimoto, K. Moriya, T. Hasegawa, K. Atsuchi, and K. Ohwada, ”A Micromachined Vibrating Gyroscope”, Sensors and Actuators A: Physical, Vol. 50, pp. 111-115, 1995.
W. Kuehnel, and S. Sherman, ”A Surface Micromachined Silicon Accelerometer with On-chip Detection Circuitry,” Sensors and Actuators A: Physical, Vol. 45, pp. 7-16, 1994.
”ADXL150/ADXL250: _5g to _50g, Low Noise, Low Power,Single/Dual Axis iMEMS Accelerometers”, ADXL150/ADXL250 datasheet, URL: http://www.analog.com.
X. Xiong, D. Lu, and W. Wang, ”A Bulk-micromachined Comb Accelerometer with Floating Interconnects”, Proceedings of 48th IEEE InternationalMidwest Symposium on Circuits and Systems (MWSCAS’05), Cincinnati, Ohio, Aug 7-10, 2005, accepted to be published.
N. Deb, and R. D. Blanton, ”Analysis of Failure Sources in Surfacemicromachined MEMS”, Proc. of International Test Conference, pp. 739-749, Oct. 2000.
X. Xiong, Y. Wu, W. Jone, ”A Dual-Mode Built-In Self-Test Technique for Capacitive MEMS Devices”, Proc. of the 22nd IEEE VLSI Test Symposium (VTS’04), pp. 148-153, May 25-29, 2004.
B. Li, D. Lu, and W. Wang, ”Open-loop Operating Mode of Micromachined Capacitive Accelerometer”, Sensors and Actuators A: Physical, Vol. 79, pp. 219-223, 2000.
J. Hirase, ”Yield Increase of VLSI after Redundancy-repairing,” Proc. of 10th Asian Test Symposium, pp.353-358, Nov. 2001.
T. L. Michalka, R. C. Varshney, and J. D. Meindl, ”A Discussion of Yield Modeling with Defect Clustering, Circuit Repair, and Circuit Redundancy”, IEEE Transactions on Semiconductor Manufacturing, Vol. 3, Issue 3, pp.116-127, Aug. 1990.
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Xiong, X., Wu, YL., Jone, WB. (2007). A Self-repairable MEMS Comb Accelerometer. In: Elleithy, K., Sobh, T., Mahmood, A., Iskander, M., Karim, M. (eds) Advances in Computer, Information, and Systems Sciences, and Engineering. Springer, Dordrecht. https://doi.org/10.1007/1-4020-5261-8_13
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