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References

  1. R. Ghaffarian, N. Kim, D. Rose, B. Hunter, K. Devitt, and T. Long, Rapid qualification of CSP assemblies by increase of ramp rates and cycling temperature ranges, The Proceedings of Surface Mount International, Chicago, Sept. 30–Oct. 4, 2001.

    Google Scholar 

  2. R. Ghaffarian, G. Nelson, M. Cooper, D. Lam, S. Strudler, A. Umdekar, K. Selk, B. Bjorndahl, and R. Duprey, Thermal cycling test results of CSP and RF package assemblies, The Proceedings of Surface Mount International, Chicago, Sept. 25–28, 2000.

    Google Scholar 

  3. J. Fjelstad, R. Ghaffarian, and Y.G. Kim, Chip Scale Packaging for Modern Electronics, Electrochemical Publications, 2002.

    Google Scholar 

  4. R. Ghaffarian, Chip scale package assembly reliability, in K. Puttlitz and P. Totta, Eds., Area Array Interconnect Handbook, Kluwer Academic Publishers, 2002, Chapter 23.

    Google Scholar 

  5. R. Ghaffarian, BGA assembly reliability, Chapter 20, in K. Gilleo, Ed., Area Array Packaging Handbook, McGraw-Hill Publisher. [date?]

    Google Scholar 

  6. R. Ghaffarian, Characterization and failure analyses of lead-free solder alloy defects, Chapter 16, in D. Shangguan, Ed., Lead-Free Solder Interconnect Reliability 2006, to be published by ASM International.

    Google Scholar 

  7. IPC-9701, Performance test methods and qualification requirements for surface mount solder attachments, Published by IPC, Association Connecting Electronics Industries.

    Google Scholar 

  8. A. Mawer and L. Luquette, Interconnect reliability of ball grid array and direct chip attach, IRPS 1997 Tutorial, 1997.

    Google Scholar 

  9. http://www.amkor.com.

  10. http://www.altera.com.

  11. http://www.xilinx.com.

  12. A.C. Shiah and X. Zhou, A low cost reliability assessment for double-sided mirror-imaged flip chip BGA assemblies, The Proceedings of Pan Pacific Conference, Surface Mount Technology Association, 2002.

    Google Scholar 

  13. J.W. Evans, J.Y. Evans, R. Ghaffarian, A. Mawer, K. Lee, and C. Shin, Monte Carlo simulation of BGA failure distributions for virtual qualification, ASME, Hawaii, 1991.

    Google Scholar 

  14. K. Newman, M. Freda, H. Ito, N. Yama, and E. Nakanishi, Enhancements in 175 FPBGA board-level solder joint reliability through package constructions, The Proceedings of the 6th Pan Pacific Microelectronics Symposium, Kauai, HI, Jan. 2001.

    Google Scholar 

  15. R.N. Master and O.T. Ong, Ceramic grid array technologies for ACPI applications, The Proceedings of Surface Mount International, Chicago, Sept. 25–28, 2000.

    Google Scholar 

  16. M. Farooq, L. Goldmann, G. Martin, C. Goldsmith, and C. Bergeron, Thermo-mechanical fatigue reliability of Pb-free ceramic ball grid arrays: experimental data and lifetime prediction mounting, The Proceeding of IEEE Electronic Components and Technology, 2003, pp. 827–833.

    Google Scholar 

  17. Z. Burnette, et al., Underfilled BGAs for ceramic BGA packages and board-level reliability, The Proceeding of IEEE Electronic Components and Technology, 2000, pp. 1221–1226.

    Google Scholar 

  18. R.N. Master, T.P. Dobear, M.S. Cole, and G.B. Martin, Ceramic ball grid array for AMD K6 microprocessors applications, Proc. Components and Technology Conference, Seattle, Washington, 1998.

    Google Scholar 

  19. S.Y. Teng and M. Brillhart, Reliability assessment of a hight CTE CBGA for high availability systems, Proc. Components and Technology Conference, 2002.

    Google Scholar 

  20. M. Interrante, et al., Lead-free package interconnection for ceramic grid arrays, IEEE/CPMT/SEMI Int’s Electronics Manufacturing Technology Symposium, 2003.

    Google Scholar 

  21. R. Ghaffarian, Comparison of X-ray inspection systems for BGA/CCGA quality assurance and crack detection, IPC SMEMA Council APEX Confererence, 2003.

    Google Scholar 

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Ghaffarian, R. (2007). Area Array Technology for High Reliability Applications. In: Suhir, E., Lee, Y.C., Wong, C.P. (eds) Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging. Springer, Boston, MA. https://doi.org/10.1007/0-387-32989-7_8

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  • DOI: https://doi.org/10.1007/0-387-32989-7_8

  • Publisher Name: Springer, Boston, MA

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