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Computer engineering: Feeling the heat

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The more that microcircuits are shrunk, the hotter they get. Engineers are on the hunt for ways to cool off computing.

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References

  1. Garimella, S. V. et al. IEEE Trans. Components Packaging Technol. 31, 801–815 (2008).

    Article  Google Scholar 

  2. Chu, R. C., Simons, R. E., Ellsworth, M. J., Schmidt, R. R. & Cozzolino, V. IEEE Trans. Device Mater. Reliability 4, 568–585 (2004).

    Article  Google Scholar 

  3. Ellsworth, M. J. et al. ITHERM 266–274 (2008).

  4. Shaegh, S. A. M., Nguyen, N.-T. & Chan, S. H. Int. J. Hydrogen Energ. 36, 5675–5694 (2011).

    Article  Google Scholar 

  5. Ruch, P. W., Rapp, T., Schmidt, T. J. & Michel, B. Studies of power density in microfluidic redox flow cells. Abstract presented at the 63rd Annual Meeting of the International Society of Electrochemistry (2012).

  6. Ruch, P., Brunschwiler, T., Escher, W., Paredes, S. & Michel, B. IBM J. Res. & Dev. 55, 593–605 (2011).

    Article  Google Scholar 

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Authors and Affiliations

  1. Philip Ball is a writer based in London.,

    Philip Ball

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  1. Philip Ball
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IBM Zurich

Bruno Michel

SuperMUC at the Leibniz Rechenzentrum

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Ball, P. Computer engineering: Feeling the heat. Nature 492, 174–176 (2012). https://doi.org/10.1038/492174a

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