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Reduced impedance and superconductivity of SnAgCu solder alloy at high frequency

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Abstract

Skin effect of lead-free solder joints is investigated over a wide frequency band. Contrary to common believe that ‘effective impedance of solder alloys increases with frequency’, resistance tends to saturate when frequency reaches a critical value, 10 MHz for SAC solder alloys. Negative surface impedance growth rate is observed when employs square waveform AC current loading at high current density. Further increased frequency causes a dramatic reduction of effective resistance. At 11 MHz with current density of 106 A/cm2, effective resistance of solder alloy drops to near zero value.

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Authors and Affiliations

  1. Electronic Packaging Laboratory, University at Buffalo, The State University of New York, Buffalo, NY, 14260, USA

    Wei Yao & Cemal Basaran

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  1. Wei Yao
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  2. Cemal Basaran
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Correspondence to Cemal Basaran.

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Yao, W., Basaran, C. Reduced impedance and superconductivity of SnAgCu solder alloy at high frequency. Electron. Mater. Lett. 8, 503–505 (2012). https://doi.org/10.1007/s13391-012-2054-6

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  • DOI: https://doi.org/10.1007/s13391-012-2054-6

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