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Thermal Properties, Electrochemical Behavior, and Microstructure of Zn-5Sn-2Cu-1.5Bi-xRE High-Temperature Solder

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Abstract

This paper reports the investigation on RE addition into a novel Zn-5Sn-2Cu-1.5Bi-xRE (ZSCB-xRE) high-temperature solder to improve its various performances. The effects of minor rare earth metal (RE) on the thermal properties, microstructure, and electrochemical behavior as well as the mechanical properties of ZSCB-xRE solders were studied. Results showed that when the addition of RE was ≤0.1 wt.%, the change in melting temperature of ZSCB-xRE solder was negligible, but the melting range of the solder alloy decreased. Meanwhile, the measured size, Λ, of nonaligned dendrites of primary ε dramatically increased from 57 ± 0.5 to 147 ± 1.3 μm, which plays interdependent roles on the resulting corrosion behavior. ZSCB-xRE solders with much RE content have much higher Λ. This is shown to be a driving-force leading to the increase in the corrosion resistance and mechanical properties of ZSCB-xRE solders.

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Acknowledgment

This research is supported by the Program for the Development of Science and Technology of Jilin Province, China (Grant No. 20115003).

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  1. Key Laboratory of Automobile Materials of Ministry of Education, School of Materials Science and Engineering, Jilin University, No. 5988 Renmin Street, Changchun, 130025, China

    Fei Xing & Xiaoming Qiu

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  1. Fei Xing
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  2. Xiaoming Qiu
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Correspondence to Xiaoming Qiu.

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Xing, F., Qiu, X. Thermal Properties, Electrochemical Behavior, and Microstructure of Zn-5Sn-2Cu-1.5Bi-xRE High-Temperature Solder. J. of Materi Eng and Perform 24, 1679–1686 (2015). https://doi.org/10.1007/s11665-015-1416-2

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  • DOI: https://doi.org/10.1007/s11665-015-1416-2

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