Abstract
Synchrotron x-ray microdiffraction (\(\upmu \hbox {XRD}\)) allows characterization of a crystalline material in small, localized volumes. Phase composition, crystal orientation and strain can all be probed in few-second time scales. Crystalline changes over a large areas can be also probed in a reasonable amount of time with submicron spatial resolution. However, despite all the listed capabilities, \(\upmu \hbox {XRD}\) is mostly used to study pure materials but its application in actual device characterization is rather limited. This article will explore the recent developments of the \(\upmu \hbox {XRD}\) technique illustrated with its advanced applications in microelectronic devices and solar photovoltaic systems. Application of \(\upmu \hbox {XRD}\) in microelectronics will be illustrated by studying stress and microstructure evolution in Cu TSV (through silicon via) during and after annealing. The approach allowing study of the microstructural evolution in the solder joint of crystalline Si solar cells due to thermal cycling will be also demonstrated.
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G. Zhou, W. Zhu, H. Shen, Y. Li, A. Zhang, N. Tamura, and K. Chen, Sci. Rep. 6, 28144 (2016).
X. Chen, N. Tamura, A. MacDowell, and R.D. James, Appl. Phys. Lett. 108, 211902 (2016).
A. Budiman, K.R. Narayanan, N. Li, J. Wang, N. Tamura, M. Kunz, and A. Misra, Mater. Sci. Eng. A 635, 6 (2015).
A. Budiman, P. Besser, C. Hau-Riege, A. Marathe, Y.C. Joo, N. Tamura, J. Patel, and W. Nix, J. Electron. Mater. 38, 379 (2009).
A. Budiman, C. Hau-Riege, W. Baek, C. Lor, A. Huang, H. Kim, G. Neubauer, J. Pak, P. Besser, and W. Nix, J. Electron. Mater. 39, 2483 (2010).
K. Chen, N. Tamura, B. Valek, and K. Tu, J. Appl. Phys. 104, 013513 (2008).
Y. Liu, N. Tamura, D.W. Kim, S. Gu, and K. Tu, Scr. Mater. 102, 39 (2015).
A. Budiman, H.A.S. Shin, B.J. Kim, S.H. Hwang, H.Y. Son, M.S. Suh, Q.H. Chung, K.Y. Byun, N. Tamura, M. Kunz, and Y.C. Joo, Microelectron. Reliab. 52, 530 (2012).
A. Budiman, G. Illya, V. Handara, W. Caldwell, C. Bonelli, M. Kunz, N. Tamura, and D. Verstraeten, Sol. Energy Mater. Sol. Cells 130, 303 (2014).
K.N. Rengarajan, I. Radchenko, G. Illya, V. Handara, M. Kunz, N. Tamura, and A.S. Budiman, Procedia Eng. 139, 76 (2016).
S.K. Tippabhotla, I. Radchenko, K.N. Rengarajan, G. Illya, V. Handara, M. Kunz, N. Tamura, and A.S. Budiman, Procedia Eng. 139, 123 (2016).
R. Barabash and G. Ice (eds.), Strain and Dislocation Gradients from Diffraction. Spatially Resolved Local Structure and Defects (London: Imperial College Press, 2014), p. 125.
N. Tamura, M. Kunz, K. Chen, R. Celestre, A. MacDowell, and T. Warwick, Mater. Sci. Eng. A 524, 28 (2009).
K. Banerjee, S.J. Souri, P. Kapur, and K.C. Saraswat, Proc. IEEE 89, 602 (2001).
J.U. Knickerbocker, P.S. Andry, L.P. Buchwalter, A. Deutsch, R.R. Horton, K.A. Jenkins, Y.H. Kwark, G. McVicker, C.S. Patel, R.J. Polastre, R.J. Schuster, A. Sharma, S.M. Sri-Jayantha, C.W. Surovic, C.K. Tsang, B.C. Webb, S.L. Wright, S.R. McKnight, E.J. Sprogis, and B. Dang, IBM J. Res. Dev. 49, 725 (2005).
S.E. Thompson, G. Sun, Y.S. Choi, and T. Nishida, IEEE Trans. Electron. Dev. 53, 1010 (2006).
C. Okoro, Y. Yang, B. Vandevelde, B. Swinnen, D. Vandepitte, B. Verlinden, and I. De Wolf, in International Interconnect Technology Conference, 2008 (IITC 2008) (2008), p. 16.
X. Liu, Q. Chen, P. Dixit, R. Chatterjee, R.R. Tummala, and S.K. Sitaraman, in 59th Electronic Components and Technology Conference, 2009 (ECTC 2009) (2009), p. 624.
M.H. Liao, M.Y. Yu, G.H. Liu, C.H. Chen, and T.K. Hsu, AIP Adv. 3, 082123 (2013).
S.S. Sapatnekar, IEEE J. Emerg. Sel. Top. Circuits Syst. 1, 5 (2011).
J.M. Paik, I.M. Park, and Y.C. Joo, Thin Solid Films 504, 284 (2006).
T. Tian, R. Morusupalli, H. Shin, H.Y. Son, K.Y. Byun, Y.C. Joo, R. Caramto, L. Smith, Y. Shen, M. Kunz, N. Tamura, and A. Budiman, Procedia Eng. 139, 101 (2016).
K.H. Lu, X. Zhang, S.K. Ryu, J. Im, R. Huang, and P.S. Ho, in 59th Electronic Components and Technology Conference, 2009 (ECTC 2009) (2009), p. 630.
T. Lu, J. Yang, Z. Suo, A. Evans, R. Hecht, and R. Mehrabian, Acta Metall. Mater. 39, 1883 (1991).
D.S. Steinberg, Preventing Thermal Cycling and Vibration Failures in Electronic Equipment (New York: Wiley, 2001).
A.M. Gabor, M. Ralli, S. Montminy, L. Alegria, C. Bordonaro, J. Woods, L. Felton, M. Davis, B. Atchley, and T. Williams, in 21st European Photovoltaic Solar Energy Conference (Dresden, 2006), p. 4.
J. Wendt, M. Träger, M. Mette, A. Pfennig, and B. Jäckel, in Proceedings of the 24th EUPVSEC (2009), p. 3420.
H. Pang, K. Tan, X. Shi, and Z. Wang, Mater. Sci. Eng. A 307, 42 (2001).
J.H. Pang, T. Low, B. Xiong, X. Luhua, and C. Neo, Thin Solid Films 462, 370 (2004).
Z. Mei, M. Ahmad, M. Hu, and G. Ramakrishna, in Proceedings of the 55th Electronic Components and Technology Conference, 2005 (2005), p. 415.
B.J. Kim, G.T. Lim, J. Kim, K. Lee, Y.B. Park, H.Y. Lee, and Y.C. Joo, J. Electron. Mater. 39, 2281 (2010).
B.D. Culty, Elements of X-ray Diffraction (New York: Addision-Wesley, 1978), p. 149
B.J. Kim, J.H. Kim, S.H. Hwang, A.S. Budiman, H.Y. Son, K.Y. Byun, N. Tamura, M. Kunz, D.I. Kim, and Y.C. Joo, J. Electron. Mater. 41, 712 (2012).
Acknowledgement
The authors gratefully acknowledge collaborations with Nanyang Technological University (NTU), Singapore, the Massachusetts Institute of Technology (MIT), USA, the SEMATECH in the USA and SK Hynix, Inc. in Korea, along with SunPower Corporation in USA through experimental work, discussion and providing critical samples by which this comparison/survey study became possible. Critical support and infrastructure provided by Singapore University of Technology and Design (SUTD) for all authors during the manuscript preparation is much appreciated. ASB and SKT gratefully acknowledge the funding and support from National Research Foundation (NRF)/Economic Development Board (EDB) of Singapore for the project under EIRP Grant ‘(NRF2013EWT – EIRP002-017) – Enabling Thin Silicon Technologies for Next Generation, Lower Cost Solar PV Systems’. ASB and IR gratefully acknowledge the funding and support from SUTD-MIT International Design Center (IDC) for the project under Grant ’IDG31400102 – Designing Nanomaterials through Atomic Interface Engineering’. The Advanced Light Source (ALS) is supported by the Director, Office of Science, Office of Basic Energy Sciences, of the U.S. Department of Energy under Contract No. DE-AC02-05CH11231 at the Lawrence Berkeley National Laboratory (LBNL).
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Radchenko, I., Tippabhotla, S.K., Tamura, N. et al. Probing Phase Transformations and Microstructural Evolutions at the Small Scales: Synchrotron X-ray Microdiffraction for Advanced Applications in 3D IC (Integrated Circuits) and Solar PV (Photovoltaic) Devices. J. Electron. Mater. 45, 6222–6232 (2016). https://doi.org/10.1007/s11664-016-5012-5
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DOI: https://doi.org/10.1007/s11664-016-5012-5