Abstract
To ensure safe operating temperatures of the ever smaller heat generating electronic devices, drastic measures should be taken. Heat spreaders are used to increase surface area, by spreading the heat without necessarily transferring it to the ambient in the first place. The heat flow pattern is investigated in heat spreaders and the fundamental differences regarding how heat conducts in different materials is addressed. Isotropic materials are compared with anisotropic ones having a specifically higher in-plane thermal conductivity than through plane direction. Thermal resistance models are proposed for anisotropic and isotropic heat spreaders in compliance with the order of magnitude of dimensions used in electronics packaging. After establishing thermal resistance models for both the isotropic and anisotropic cases, numerical results are used to find a correlation for predicting thermal resistance in anisotropic heat spreaders with high anisotropy ratios.
Similar content being viewed by others
References
D.J. Nelson and W.A. Sayers, Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM VIII., Eighth Annual IEEE (1992), pp. 62–68.
G.N. Ellison, IEEE Trans. Components Packag. Technol. (2003).
Y.S. Muzychka, M.M. Yovanovich, and J.R. Culham, 36th AIAA Thermophys. Conference, AIAA Paper 4187 (2003).
Y.S. Muzychka, J.R. Culham, and M.M. Yovanovich, 36th AIAA Thermophys. Conference, AIAA Paper 4188 (2003).
M.M. Yovanovich, Y.S. Muzychka, and J.R. Culham, J. Thermophys. Heat Transf. 13, 495 (1999).
E. Sadeghi, M. Bahrami, and N. Djilali, ASME Heat Transfer Summer Conference Collocated with the Fluids Engineering Energy Sustainability and 3rd Energy Nanotechnology Conferences (2008), pp. 265–275.
A. Gholami and M. Bahrami, J. Thermophys. Heat Transf. 28, 679 (2014).
Y.S. Muzychka, 44th AIAA Thermophys. Conference (2013), pp. 1–11.
T.M. Ying and K.C. Toh, ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Vol. 1 (IEEE, 2000), pp. 314–321.
D.D.L. Chung and Y. Takizawa, J. Electron. Mater. 41, 2580 (2012).
G. Sidebotham, Heat Transfer Modeling: An Inductive Approach (Berlin: Springer, 2015), p. 241.
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Falakzaadeh, F., Mehryar, R. Heat Flow Pattern and Thermal Resistance Modeling of Anisotropic Heat Spreaders. J. Electron. Mater. 46, 64–72 (2017). https://doi.org/10.1007/s11664-016-4854-1
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s11664-016-4854-1