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Microstructural Evolution of Intermetallic Compounds in TCNCP Cu Pillar Solder Joints

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Abstract

This study investigated the microstructure, especially intermetallic compounds (IMCs), formed between a Cu pillar and Cu trace joined by thermal compression bonding with nonconductive paste (NCP). Continuous, uniform layers of Cu3Sn formed on the surface of both the Cu pillar and Cu trace. However, the growth of Cu6Sn5 was suppressed, forming nonuniformly on the Cu trace due to NCP filler entrapment at the Cu–solder interface that hindered Sn diffusion flux. Multireflow induced rapid growth of IMCs within the Cu pillar solder joint. The combination of multireflow and thermal cycle testing gave rise to asymmetric growth of IMCs between the chip side and substrate side as a result of stress migration induced by thermal cycling.

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Authors and Affiliations

  1. Department of Materials Science and Engineering, National Cheng Kung University, No. 1, University Road, Tainan, 701, Taiwan, ROC

    Chien-Lung Liang & Kwang-Lung Lin

  2. ASE Group Kaohsiung, No. 26, Chin 3rd Road, Nantze Export Processing Zone, Kaohsiung, Taiwan, ROC

    Jr-Wei Peng

Authors
  1. Chien-Lung Liang
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  2. Kwang-Lung Lin
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  3. Jr-Wei Peng
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Correspondence to Chien-Lung Liang.

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Liang, CL., Lin, KL. & Peng, JW. Microstructural Evolution of Intermetallic Compounds in TCNCP Cu Pillar Solder Joints. J. Electron. Mater. 45, 51–56 (2016). https://doi.org/10.1007/s11664-015-4065-1

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  • DOI: https://doi.org/10.1007/s11664-015-4065-1

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