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In Situ Synchrotron X-ray Diffraction Measurement of the Strain Distribution in Si Die for the Embedded Substrates

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Abstract

Three-dimensional packaging provides an acceptable solution for miniaturized integrated circuits. Because of the technological flexibility required for combining various modules to form a functional system, miniaturization can be achieved by using embedded techniques that could enhance the reliability of assembled systems. Because the mismatch of the thermal expansion coefficient among the materials has been an emerging issue when embedded components are subjected to thermal cycles, this study adopted the in situ synchrotron x-ray method to measure the strain distribution of a Si die in embedded substrates at various temperatures ranging from 25°C to 150°C. The out-of-plane strain of the Si die became less compressive when the temperature was increased. The numerical simulation of the finite elements software ANSYS also indicated the similar consequence of the strain behavior.

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Authors and Affiliations

  1. Department of Chemical and Materials Engineering, National Central University, Jhongli City, 320, Taiwan

    Hsueh Hsien Hsu, Hao Chen, Yao Tsung Ouyang & Albert T. Wu

  2. Department of Mechanical Engineering, National Cheng Kung University, Tainan City, 701, Taiwan

    Tz Cheng Chiu

  3. Industrial Technology Research Institute, Chutung, Hsinchu, 310, Taiwan

    Tao Chih Chang

  4. National Synchrotron Radiation Research Center, Hsinchu Science Park, Hsinchu, 300, Taiwan

    Hsin Yi Lee & Chin Shun Ku

Authors
  1. Hsueh Hsien Hsu
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  2. Hao Chen
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  3. Yao Tsung Ouyang
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  4. Tz Cheng Chiu
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  5. Tao Chih Chang
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  6. Hsin Yi Lee
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  7. Chin Shun Ku
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  8. Albert T. Wu
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Correspondence to Albert T. Wu.

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Hsu, H.H., Chen, H., Ouyang, Y.T. et al. In Situ Synchrotron X-ray Diffraction Measurement of the Strain Distribution in Si Die for the Embedded Substrates. J. Electron. Mater. 44, 3942–3947 (2015). https://doi.org/10.1007/s11664-015-3780-y

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  • DOI: https://doi.org/10.1007/s11664-015-3780-y

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