A low-temperature bonding process to form joints with high strength and ionic migration resistance using mixed Cu–Ag nanoparticles was studied. Although it was difficult to obtain strong joints using Cu nanoparticles, with the addition of Ag nanoparticles to the Cu nanoparticles the bonding strength of the Cu-to-Cu joints increased. The joints formed by the mixed Cu–Ag nanoparticles at 350°C exhibited a high bonding strength of ~50 MPa. Counterelectrodes made of the mixed Cu–Ag nanoparticles had four times higher ionic migration resistance compared with counterelectrodes made only of Ag nanoparticles.
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Morisada, Y., Nagaoka, T., Fukusumi, M. et al. A Low-Temperature Bonding Process Using Mixed Cu–Ag Nanoparticles. J. Electron. Mater. 39, 1283–1288 (2010). https://doi.org/10.1007/s11664-010-1195-3
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DOI: https://doi.org/10.1007/s11664-010-1195-3