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Effect of Post-annealing on Grain Boundary of Nano-crystalline Cu Processed by Powder High-Pressure Torsion

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Abstract

High tensile strength of 616 MPa and improved ductility of 7.6 pct were obtained in powder-consolidated pure Cu processed by high-pressure torsion (HPT) at room temperature followed by post-annealing at 673 K (400 °C). The powder-HPT consolidation process maintained nano-crystalline microstructures even after post-annealing due to the presence of well-dispersed oxide particles in the matrix. Higher ductility in the post-annealed specimen is attributed to higher fraction of stable Σ3 coincidence site lattice boundaries than that in the HPT-processed Cu.

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This study was supported by A.D.D. through basic research project (11-01-04-08).

Author information

Authors and Affiliations

  1. Materials Deformation Department, Korea Institute of Materials Science (KIMS), Changwon, 641-831, Korea

    Eun Yoo Yoon (Senior Researcher)

  2. Department of Materials Science and Engineering, POSTECH, Pohang, 790-784, Korea

    Dong Jun Lee (Ph.D. Candidate), Sunghak Lee (Professor) & Hyoung Seop Kim (Professor)

  3. Agency for Defense Development (ADD), Daejeon, 305-152, Korea

    Lee Ju Park (Principal Researcher)

  4. Center for Advanced Aerospace Materials, POSTECH, Pohang, 790-784, Korea

    Sunghak Lee (Professor) & Hyoung Seop Kim (Professor)

  5. Mechanical Design and Production Department, Zagazig University, Zagazig, Egypt

    Mohamed Ibrahim Abd El Aal (Lecturer)

Authors
  1. Eun Yoo Yoon
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  2. Dong Jun Lee
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  3. Lee Ju Park
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  4. Sunghak Lee
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  6. Hyoung Seop Kim
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Corresponding author

Correspondence to Hyoung Seop Kim.

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Manuscript submitted February 20, 2014.

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Yoon, E.Y., Lee, D.J., Park, L.J. et al. Effect of Post-annealing on Grain Boundary of Nano-crystalline Cu Processed by Powder High-Pressure Torsion. Metall Mater Trans A 45, 4748–4752 (2014). https://doi.org/10.1007/s11661-014-2466-z

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  • DOI: https://doi.org/10.1007/s11661-014-2466-z

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