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Preparation of thermal-enhanced epoxy resin adhesive with organic PCM for applying wood flooring

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Abstract

Epoxy resins are well-known materials that show beneficial properties, such as high tensile strength and modulus, good adhesive properties, low cost, and ease of processing and environmental advantages. However, epoxy resin adhesive has no characteristic of thermal storage. Latent heat storage is one of the favorable kinds of thermal energy storage methods considered for energy saving and thermal efficiency in various fields, such as solar air conditioning systems and buildings. So we prepared thermal-enhanced epoxy resin adhesive by using PCM. This paper addresses the effects of n-hexadecane and sodium lauryl sulfate on the thermal properties and chemical properties of epoxy resin adhesive and HEAC, using differential scanning calorimetry, thermal gravimetric analysis, and Fourier transform-infrared spectroscopy. Also, we evaluated the applicability of composite epoxy resin adhesive to wood-based flooring using n-hexadecane, through measurement of bonding strength from universal testing machine analysis.

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Acknowledgements

This research was supported by Basic Science Research Program through the National Research Foundation of Korea (NRF) funded by the Ministry of Science, ICT & Future Planning (2013R1A1A1058448).

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Authors and Affiliations

  1. Building Environment & Materials Lab, School of Architecture, Soongsil University, Seoul, 156-743, Korea

    Su-Gwang Jeong, Junghoon Cha, Sughwan Kim, Jungki Seo, Jeong-Hun Lee & Sumin Kim

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  1. Su-Gwang Jeong
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  2. Junghoon Cha
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  3. Sughwan Kim
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  4. Jungki Seo
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  5. Jeong-Hun Lee
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  6. Sumin Kim
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Correspondence to Sumin Kim.

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Jeong, SG., Cha, J., Kim, S. et al. Preparation of thermal-enhanced epoxy resin adhesive with organic PCM for applying wood flooring. J Therm Anal Calorim 117, 1027–1034 (2014). https://doi.org/10.1007/s10973-014-3862-8

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  • DOI: https://doi.org/10.1007/s10973-014-3862-8

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