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Predicted stresses in ball-grid-array (BGA) and column-grid-array (CGA) interconnections in a mirror-like package design

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Abstract

There is an obvious incentive for using bow-free (temperature change insensitive) assemblies in various areas of engineering, including electron device and electronic packaging fields. The induced stresses in a bow-free assembly could be, however, rather high, considerably higher than in an assembly, whose bow is not restricted. The simplest and trivial case of a bow-free assembly is a tri-component body, in which the inner component is sandwiched between two identical outer components (“mirror” structure), is addressed in our analysis, and a simple and physically meaningful analytical stress model is suggested. It is concluded that if acceptable stresses (below yield stress of the solder material) are achievable, a mirror (bow-free, temperature-change-insensitive) design should be preferred, because it results in an operationally stable performance of the system.

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Authors and Affiliations

  1. Portland State University, Portland, OR, USA

    E. Suhir

  2. Technische Universität Wien, Vienna, Austria

    E. Suhir

  3. Ariel University, Ariel, Israel

    E. Suhir

  4. ERS Co. LLC, 727 Alvina Ct., Los Altos, CA, 94024, USA

    E. Suhir

  5. Jet Propulsion Laboratory, California Institute of Technology, 4800 Oak Grove Dr., Pasadena, CA, 91109, USA

    R. Ghaffarian

  6. Department of Applied Electronic Materials, Institute of Sensor and Actuator Systems, Technische Universität Wien, Gusshausstrasse 27-29, 1040, Vienna, Austria

    J. Nicolics

Authors
  1. E. Suhir
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  2. R. Ghaffarian
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  3. J. Nicolics
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Correspondence to E. Suhir.

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Suhir, E., Ghaffarian, R. & Nicolics, J. Predicted stresses in ball-grid-array (BGA) and column-grid-array (CGA) interconnections in a mirror-like package design. J Mater Sci: Mater Electron 27, 2430–2441 (2016). https://doi.org/10.1007/s10854-015-4042-8

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  • DOI: https://doi.org/10.1007/s10854-015-4042-8

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