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Through-hole filling characteristics of solderable polymer composites with low melting point alloy fillers

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Abstract

In this paper, we describe the development of a novel through-hole filling technique using solderable polymer composites (SPCs) with low-melting-point-alloy (LMPA) fillers. Three types of SPCs with different LMPA concentrations (40, 50 and 60 vol%) were formulated, and through-hole filling tests were conducted under different environmental reflow conditions (atmospheric pressure and decompression conditions). The results indicated that the through-hole filling assemblies showed weak filling characteristics with huge defects under atmospheric pressure reflow conditions because polymer trapped in the hole. On the other hand, the through-hole filling assemblies fabricated under decompression reflow conditions showed favorable filling characteristics and excellent, stable electrical properties due to the effective removal of polymer from the through-hole.

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Acknowledgments

This research was supported by the Chung-Ang University Research Scholarship Grants in 2014 and Basic Science Research Program through the National Research Foundation of Korea (NRF) funded by the Ministry of Science, ICT and future Planning (2014007164).

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Authors and Affiliations

  1. School of Mechanical Engineering, Chung-Ang University, Seoul, 156-756, Republic of Korea

    Jeong Il Lee, Byung-Seung Yim, Mu Seong Yun & Jong-Min Kim

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  1. Jeong Il Lee
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  2. Byung-Seung Yim
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  3. Mu Seong Yun
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Correspondence to Jong-Min Kim.

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Lee, J.I., Yim, BS., Yun, M.S. et al. Through-hole filling characteristics of solderable polymer composites with low melting point alloy fillers. J Mater Sci: Mater Electron 27, 982–991 (2016). https://doi.org/10.1007/s10854-015-3842-1

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