Skip to main content
SpringerLink
Log in

Effects of moisture absorption on the electrical parameters of embedded capacitors with epoxy-BaTiO3 nanocomposite dielectric

  • Published:
Journal of Materials Science: Materials in Electronics Aims and scope Submit manuscript

Abstract

In this work the effects of moisture absorption on the electrical parameters of embedded capacitors is investigated. Capacitors of two different areas embedded inside a four-layered printed wiring board were selected for this work. The dielectric was a nanocomposite of epoxy and BaTiO3 which is common dielectric material used in embedded capacitors. These capacitors were exposed to elevated temperature and humidity conditions (85 °C and 85% RH) and two parameters, capacitance and dissipation factor, were measured in situ. The diffusion of moisture in the dielectric was also modeled using the finite element method (FEM), and the changes in electrical parameters were calculated theoretically. The FEM methodology was then verified by applying it on capacitors of different dimensions.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8
Fig. 9
Fig. 10
Fig. 11
Fig. 12
Fig. 13

Similar content being viewed by others

References

  1. Y. Rao, J. Yue, C. Wong, Material characterization of high dielectric constant polymer-ceramic composite for embedded capacitor to RF application. J. Appl. Polym. Sci. 92(4), 2228–2231 (2004)

    Article  CAS  Google Scholar 

  2. J. Rector, J. Dougherty, V. Brown, J. Galvagni, J. Prymak, Integrated and Integral Passive Components: A Technology Roadmap (Electronic Components and Technology Conference, San Jose, 1997), pp. 713–723

    Google Scholar 

  3. J. Rector, Economic and Technical Viability of Integral Passives (Electronic Components and Technology Conference Seattle, Seattle, 1999), pp. 218–224

    Google Scholar 

  4. M. Alam, M.H. Azarian, M. Osterman, M. Pecht, Effectiveness of embedded capacitors in reducing the number of surface mount capacitors for decoupling applications. Circuit World 36(1), 22–30 (2010)

    Article  Google Scholar 

  5. M. Alam, M.H. Azarian, M. Osterman, M. Pecht, Prognostics of failures in embedded planar capacitors using model-based and data-driven approaches. J. Intell. Mater. Syst. Struct. 22, 1293–1304 (2011)

    Article  Google Scholar 

  6. R. Ulrich, L. Schaper, Integrated Passive Component Technology (Wiley/IEEE Press, New York, 2003)

    Book  Google Scholar 

  7. P. Muthana, A. Engin, M. Swaminathan, R. Tummala, V. Sundaram, B. Wiedenman, D. Amey, K. Dietz, S. Banerji, Design, modeling and characterization of embedded capacitor networks for core decoupling in the package. IEEE Trans. Adv. Packag. 30(4), 809–822 (2007)

    Article  Google Scholar 

  8. M. Alam, M.H. Azarian, M. Osterman, M. Pecht, Temperature and voltage aging effects on electrical conduction mechanism in epoxy-BaTiO3 composite dielectric used in embedded capacitors. Microelectron. Reliab. 51(5), 946–952 (2011)

    Article  CAS  Google Scholar 

  9. S. Swartz, Topics in electronic ceramics. IEEE Trans. Electr. Insulation 25(5), 935–987 (1990)

    Article  CAS  Google Scholar 

  10. M. Keimasi, M.H. Azarian, M. Pecht, Flex cracking of multilayer ceramic capacitors assembled with Pb-free and tin-lead solders. IEEE Trans. Device Mater. Reliab. 8(1), 182–192 (2008)

    Article  CAS  Google Scholar 

  11. S. Bhattacharya, R. Tummala, Next generation integral passives: materials, processes, and integration of resistors and capacitors on PWB substrates. J. Mater. Sci. Mater. Electron. 11(3), 253–268 (2000)

    Article  CAS  Google Scholar 

  12. S. Wada, T. Hoshina, H. Yasuno, S. Nam, H. Kakemoto, T. Tsurumi, M. Yashima, Size dependence of dielectric properties for nm-sized barium titanate crystallites and its origin. J. Korean Phys. Soc. 46(1), 303–307 (2005)

    CAS  Google Scholar 

  13. K. Paik, J. Hyun, S. Lee, K. Jang, Epoxy/BaTiO 3 (SrTiO 3 ) Composite Films and Pastes for High Dielectric Constant and Low Tolerance Embedded Capacitors in Organic Substrates Vol 2 (Electronics Systemintegration Technology Conference, Dresden, 2006), pp. 794–801

    Google Scholar 

  14. J. Xu, K. Moon, P. Pramanik, S. Bhattacharya, C. Wong, Optimization of epoxy-barium titanate nanocomposites for high performance embedded capacitor components. IEEE Trans. Compon. Packag. Technol. 30(2), 248–253 (2007)

    Article  CAS  Google Scholar 

  15. C. Zou, J. Fothergill, S. Rowe, The effect of water absorption on the dielectric properties of epoxy nanocomposites. IEEE Trans. Dielectr. Electr. Insulation 15(1), 106–117 (2008)

    Article  CAS  Google Scholar 

  16. C. Zou, J. Fothergill, S. Rowe, A Water Shell Model for the Dielectric Properties of Hydrated Silica-Filled Epoxy Nano-Composites (International Conference on Solid Dielectrics, Winchester, 2007), pp. 389–392

    Google Scholar 

  17. K. Lee, S. Bhattacharya, M. Varadarajan, L. Wan, I. Abothu, V. Sundaram, P. Muthana, D. Balaraman, P. Raj, M. Swaminathan, S. Sitaram, R. Tummala, P. Viswanadham, S. Dunford, J. Lauffer, Design, Fabrication, and Reliability Assessment of Embedded Resistors and Capacitors on Multilayered Organic Substrates (International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005), pp. 249–254

  18. R. Das, J. Lauffer, V. Markovich, Fabrication, integration and reliability of nanocomposite bases embedded capacitors in microelectronics packaging. J. Mater. Chem. 18, 537–544 (2008)

    Article  CAS  Google Scholar 

  19. S. Lee, J. Hyun, J. Pak, H. Lee, H. Jeon, K. Paik, Fabrication and Characterization of Embedded Capacitors in Printed Circuit Boards Using B-Stage Epoxy/BaTiO 3 Composite Embedded Capacitor Films (ECFs) (Electronic Components and Technology Conference, Lake Buena Vista, 2008), pp. 742–746

    Google Scholar 

  20. R. Das, M. Poliks, J. Lauffer, V. Markovich, High Capacitance, Large Area, Thin film, Nanocomposite Based Embedded Capacitors (Electronic Components and Technology Conference, San Diego, 2006), pp. 1510–1515

    Google Scholar 

  21. M. Alam. M. Azarian, M. Pecht, Reliability of Embedded Planar Capacitors with Epoxy-BaTiO3 Composite Dielectric during Temperature-Humidity-Bias Tests. IEEE Trans. Device Mater. Reliab. (2011). doi:10.1109/TDMR.2011.2168527

  22. M. Pecht, H. Ardebili, A. Shukla, J. Hagge, D. Jennings, Moisture ingress into organic laminates. IEEE Trans. Compon. Packag. Technol. 22(1), 104–110 (1999)

    Article  CAS  Google Scholar 

Download references

Acknowledgments

The authors would like to express their gratitude to the over 100 companies that support the Center for Advanced Life Cycle Engineering (CALCE) consortium at the University of Maryland, College Park, MD and are sponsoring this project. We thank Mark Zimmerman at CALCE (University of Maryland) for his invaluable suggestions. We thank Elviz George and Vikram Srinivas at CALCE for assistance in performing experiments. We also acknowledge the CALCE Test Services and Failure Analysis lab for assistance in performing some experiments.

Author information

Authors and Affiliations

  1. Center for Advanced Life Cycle Engineering (CALCE), University of Maryland, 1103 EGL Building, College Park, MD, 20742, USA

    Mohammed A. Alam, Michael H. Azarian & Michael G. Pecht

Authors
  1. Mohammed A. Alam
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Michael H. Azarian
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Michael G. Pecht
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Mohammed A. Alam.

Rights and permissions

Reprints and permissions

About this article

Cite this article

Alam, M.A., Azarian, M.H. & Pecht, M.G. Effects of moisture absorption on the electrical parameters of embedded capacitors with epoxy-BaTiO3 nanocomposite dielectric. J Mater Sci: Mater Electron 23, 1504–1510 (2012). https://doi.org/10.1007/s10854-011-0618-0

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s10854-011-0618-0

Keywords

Search

Navigation