Abstract
In this paper we report on the morphological and electrical properties of platinum (Pt) thin-films with Titanium (Ti) and, alternatively, Titanium dioxide (TiO2) as adhesion layers for high temperature applications. All films were sputter deposited on silicon substrates and afterwards annealed in air up to 800 °C. The results show that Ti diffuses into Pt grain boundaries forming oxide precipitates (TiOx) in the Pt grain boundaries. The resistivity of Pt/Ti thin-films increased continuously with annealing temperature up to 500 °C and decreases again continuously above 500 °C. In contrast, TiO2 demonstrates a dense stable oxide layer after annealing. Pt/TiO2 thin-films show a continuous decrease in the sheet resistance with increasing the annealing temperature. Accordingly, TiO2 thin-film is the preferable adhesive layer for Pt over Ti thin-films for high temperature applications.
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Ababneh A, Al-Omari AN, Marschibois M, Feili D, Seidel H (2013) Investigations on the high temperature compatibility of various adhesion layers for platinum. In: Proc. SPIE 8763, Smart sensors, actuators, and MEMS VI. doi:10.1117/12.2017333
Abe N, Otani Y, Miyake M, Kurita M, Takeda H, Okamura S, Shiosaki T (2003) Influence of a TiO2 adhesion layer on the structure and the orientation of a Pt layer in Pt/TiO2/SiO2/Si structures. Jpn J Appl Phys 42:2791–2795
Aubert T, Elmazria O, Assouar B, Bourot L, Bournebe Z, Hehn M, Veber S, Oudich M, Alnot P (2009) Study of tantalum and iridium as adhesion layers for Pt/LGS high temperature SAW devices. In: IEEE International Ultrasonics Symposium proceedings, pp 1672–1675
Caliendo C, Massimiliano Latino P (2011) Characterization of Pt/AlN/Pt-based structures for high temperature, microwave electroacoustic devices applications. Thin Solid Films 519:6326–6329
DiBattista M, Schwank JW (1999) Determination of diffusion in polycrystalline platinum thin films. J Appl Phys 86:4902–4907
Fischer G, Hoffmann H, Vancea J (1980) Mean free path and density of conductance electrons in platinum determined by the size effect in extremely thin films. Phys Rev B 22:6065–6073
Kweon SY, Yeom SJ, Sun HJ, Kim NK, Yu YS, Lee SK (1999) Intrinsic stress dependence of Pt hillock formation and its related electrical properties of SBT capacitor. Integr Ferroelectr 25:299–309
Maeder T, Sagalowicz L, Muralt P (1998) Stabilized platinum electrodes for ferroelectric film deposition using Ti, Ta and Zr adhesion layers. Jpn J Appl Phys 37:2007–2012
Okamoto H (2009) Pt-Ti (Platinum-Titanium). J Phase Equilibr Diffus 30:217–218
Prasad M, Yadav RP, Sahula V, Khanna VK (2012) FEM simulation of platinum-based microhotplate using different dielectric membranes for gas sensing applications. Sens Rev 32:59–65
Puigcorbè J, Vogel D, Michel B, Vilà A, Gràcia I, Canè C, Morante JR (2003) High temperature degradation of Pt/Ti electrodes in micro-hotplate gas sensors. J Micromech Microeng 13:119–124
Resnik D, Vrtačnik D, Možek M, Pečar B, Amon S (2011) Experimental study of heat-treated thin film Ti/Pt heater and temperature sensor properties on a Si microfluidic platform. J Micromech Microeng 21:025025
Schmid U, Seidel H (2006) Influence of thermal annealing on the resistivity of titanium/platinum thin films. J Vac Sci Technol A 24:2139–2146
Schmid U, Seidel H (2008) Effect of high temperature annealing on the electrical performance of titanium/platinum thin films. Thin Solid Films 516:898–906
Smits FM (1958) Measurement of Sheet Resistivities with the Four-Point Probe. Bell Syst Tech J 37:711–718
Tiggelaar RM, Sanders RGP, Groenland AW, Gardeniers JGE (2009) Stability of thin platinum films implemented in high-temperature microdevices. Sens Actuators A 152:39–47
Acknowledgments
This work was supported by the German Research Council (DFG) under Grant No. SE 1425/9-1 awarded to Abdallah Ababneh. The EU funding in the framework of the Project AME-Lab for the FIB/SEM instrument (European Regional Development Fund C/4-EFRE-13/2009/Br) is gratefully acknowledged.
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Ababneh, A., Al-Omari, A.N., Dagamseh, A.M.K. et al. Electrical and morphological characterization of platinum thin-films with various adhesion layers for high temperature applications. Microsyst Technol 23, 703–709 (2017). https://doi.org/10.1007/s00542-015-2715-0
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DOI: https://doi.org/10.1007/s00542-015-2715-0