Skip to main content
SpringerLink
Log in

The monolithic integration system of bulk-Si sensors and actuators based on the Au–Au bonding technology

  • Technical Paper
  • Published:
Microsystem Technologies Aims and scope Submit manuscript

Abstract

The monolithic integration of bulk-Si MEMS sensors and actuators using the Au–Au bonding technology is presented in this work. With this technology, the substrate isolation and electrical interconnection between the CMOS circuits and bulk-Si CMOS MEMS sensors are achieved perfectly. In order to demonstrate this technology, a pressure sensor and an electrothermal actuator have been monolithically designed and fabricated. In addition, by sputtering aluminium on the bulk silicon electrothermal actuator, the electrothermal actuator is modified and the sensitivity of the actuator is obviously improved. The measurement results show that the sensitivity of the pressure sensor is 0.29fF/hPa. And the sensitivities of the modified and non-modified electrothermal actuators are 20.23 μm/V and 3.34 μm/V, respectively. Compared with the non-modified electrothermal actuators, the sensitivity of the modified electrothermal actuators is improved by 6 times.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6

Similar content being viewed by others

References

  • DeHennis AD, Wise KD (2005) A wireless microsystem for the remote sensing of pressure, temperature, and relative humidity. J Microelectromech Syst 14(1):12–22

    Article  Google Scholar 

  • Erismis MA, Neves HP, Moor PD, Puers R, Hoof CV (2010) A water-tight packaging of MEMS electrostatic actuators for biomedical applications. J Microsyst Technol 16(12):2109–2113

    Article  Google Scholar 

  • Graf M, Jurischka R, Barrettino D, Hierlemann A (2005) 3D nonlinear modeling of microhotplates in CMOS technology for use as metal-oxide-based gas sensors. J Micromech Microeng 15(1):190–200

    Article  Google Scholar 

  • Jing E, Xiong B, Wang Y (2010) Low-temperature Au–Si wafer bonding. J Micromech Microeng 20(9):095014 (6 pp)

    Article  Google Scholar 

  • Judy MW (2004) Evolution of integrated inertial MEMS technology. In: Proceedings of solid-state sensor, actuator and microsystem workshop, Hilton Head Island, pp 27–32

  • Karbasi SM, Shamshirsaz M, Naraghi M, Maroufi M (2010) Optimal design analysis of electrothermally driven microactuators. J. Microsyst Technol 16(7):1065–1071

    Article  Google Scholar 

  • Kühne S, Hierold C (2011) Wafer-level bonding and direct electrical interconnection of stacked 3D MEMS by a hybrid low temperature process. Sens Actuators A 172(1):341–346

    Article  Google Scholar 

  • Liu JW, Shang JT, Tang JY, Huang QA (2011) Micromachining of Pyrex 7740 glass by silicon molding and vacuum anodic bonding. J Microelectromech Syst 20(4):909–915

    Article  Google Scholar 

  • Luo H, Zhang G, Fedder GK, Carley LR (2002) A post-CMOS micromachined lateral accelerometer. J Microelectromech Syst 11(3):188–195

    Article  Google Scholar 

  • Neumann JJ, Gabriel KJ (2002) CMOS-MEMS membrane for audio-frequency acoustic actuation. Sens Actuators A 95(2–3):175–182

    Google Scholar 

  • Park WT, Jang JW, Clare T, Liu L (2011) Microstructure and mechanical properties of aluminum–germanium eutectic bonding with polysilicon metallization for microelectromechanical systems (MEMS) packaging. Scr Mater 64(8):733–736

    Article  Google Scholar 

  • Paul O, Baltes H (1995) Novel fully CMOS compatible vacuum sensor. Sens Actuators A 46(1–3):428–431

    Google Scholar 

  • Que L, Park JS, and Gianchandani YB (1999) Bent-beam electro-thermal actuators for high force applications. In: Proceedings of 12th IEEE international conferences on micro electro mechanical systems, pp 31–36

  • Que L, Park JS, Gianchandani YB (2001) Bent-beam electrothermal actuators—Part I: single beam and cascaded devices. J Microelectromech Syst 10(2):247–254

    Article  Google Scholar 

  • Reinke J, Fedder GK, Mukherjee T (2010) CMOS-MEMS variable capacitors using electrothermal actuation. J Microelectromech Syst 19(5):1105–1115

    Article  Google Scholar 

  • Sun CM, Wang C, Tsai MH, Hsie HS, and Fang W (2008) A novel double-side CMOS-MEMS post processing for monolithic sensor integration. In: Proceedings of 21st IEEE international conferences on micro electro mechanical systems, pp 90–93

  • Tiensuu A-L, Bexell M, Schweitz J-Å, Smith L, Johnsson S (1994) Assembling three-dimensional microstructures using gold-silicon eutectic bonding. Sens Actuators A 45(3):227–236

    Article  Google Scholar 

  • Tsai JC, Lai RJ, Yin CY, Chen DS, Shen CK, Chang YT (2009) Vertical electrothermal actuator with separated metal and nitride structural layers. J Micro/Nanolith MEMS MOEMS 8(2):021114 (8 pp)

    Google Scholar 

  • Wolffenbuttel RF, Wise KD (1994) Low-temperature silicon wafer-to-wafer bonding using gold at eutectic temperature. Sens Actuators A 43(1–3):223–229

    Google Scholar 

  • Zhang Y, Huang QA, Li RG, Li W (2006) Macro-modeling for polysiliconcascadedbent beam electrothermal microactuators. Sens Actuators A 128(1):165–175

    Article  Google Scholar 

Download references

Acknowledgments

This work is supported by the National Natural Science Foundation of China (61076071) and the National High Technology Research and Development Program of China (863 Program, 2011AA040404).

Author information

Authors and Affiliations

  1. Key Laboratory of MEMS of the Ministry of Education, Southeast University, Nanjing, 210096, China

    Chunhua Cai & Ming Qin

Authors
  1. Chunhua Cai
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Ming Qin
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Ming Qin.

Rights and permissions

Reprints and permissions

About this article

Cite this article

Cai, C., Qin, M. The monolithic integration system of bulk-Si sensors and actuators based on the Au–Au bonding technology. Microsyst Technol 19, 195–201 (2013). https://doi.org/10.1007/s00542-012-1583-0

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s00542-012-1583-0

Keywords

Search

Navigation