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Solution of problem of two dissimilar materials bonded at one interface subjected to temperature

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Abstract

A solution of problem of two dissimilar materials bonded at one interface subjected to temperature is derived. To obtain a closed-form solution, a rational mapping function and a complex variable method are used. The coefficients of the homogeneous part of the stress function are expressed by Dunders’ parameters, but loading term of temperature is not expressed by them. As a demonstration, semi-strips bonded at one part at the ends are considered. The each strip is subjected to uniform temperature. Examples of stress distributions are shown. The relations of stress and temperature on the interface are described. Debondings on both sides of the interface are considered. Stress intensity of debonding (SID) is defined, and the values are investigated for various debonding lengths. And the debonding extension or the crack initiation into the material is investigated. The effects of material constants (Dundurs’ parameter) on SID are also investigated. By changing mapping function, other geometries can be analyzed.

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Authors and Affiliations

  1. Department of Civil Engineering, Nagoya Institute of Technology, Gokisocho, Showaku, Nagoya, 466-8555, Japan

    Norio Hasebe

  2. Chubu Electric Power Company, Toshincho 1, Higashiku, Nagoya, 461-8680, Japan

    Seiji Kato

Authors
  1. Norio Hasebe
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  2. Seiji Kato
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Correspondence to Norio Hasebe.

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Hasebe, N., Kato, S. Solution of problem of two dissimilar materials bonded at one interface subjected to temperature. Arch Appl Mech 84, 913–931 (2014). https://doi.org/10.1007/s00419-014-0840-3

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