Skip to main content
Log in

Using mechanical processing in recycling printed wiring boards

  • Research Summary
  • Recycling Electronic Scrap
  • Published:
JOM Aims and scope Submit manuscript

Abstract

tAs the number of electronic products in use increases, so does the need to dispose of defective and obsolete equipment, including printed circuit boards. The utilization of mechanical processing in recycling this type of waste enables recovery of the metals and allows components to be separated for proper waste disposal. Mechanical processing allows the recovery of 80% of the metals in printed circuit boards, especially copper, which represents approximately 75% of the metallic fraction.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Similar content being viewed by others

References

  1. J.E. Hoffmann, “Recovery of Precious Metals from Electronic Scrap,”JOM, 44 (6) (1992), pp. 43–48.

    CAS  Google Scholar 

  2. A. Bernardes et al., “Recycling of Printed Circuit Boards by Melting with Oxidising/Reducing Top Blowing Process” (Paper presented at the TMS Annual Meeting, Orlando, Florida, 9–13 February 1997).

  3. N. Felix and C. Riet, “Recycling of Electronic Scrap,”Proc. Precious Metals Conf. (1994), pp. 159–169.

  4. K.L. Sandvik et al., ”Development of a Mineral Processing Modelling Program as a Tool for Optimal Decisions in Waste Treatment,”REWAS 1999, vol. 1 (Warrendale, PA: TMS, 1999), pp. 55–64.

    Google Scholar 

  5. E. Larrauri, R. Miguel, and M.J. Suarez, “Recovery, Recycling and Reuse of Packing Materials from Post Consumer Wastes,” in Ref. 4, pp. 75–84.

  6. M.J. Noakes, “Using Mineral Processing Technologies for the Treatment of Hazardous Substances,” in Ref. 4, pp. 27–36.

  7. J.A.S. Tenório, D.C. Oliveira, and A.P. Chaves, “Carbon-Zinc Batteries Treatment by Ore Processing Methods,”REWAS 1999, vol. 2 (Warrendale, PA: TMS, 1999), pp. 1153–1160.

    Google Scholar 

  8. S. Zhang and E. Forssberg, “Mechanical Separation-Oriented Characterization of Electronic Scrap,”Resources, Conservation and Recycling, 21 (1997), pp. 247–269.

    Article  Google Scholar 

  9. J.J. Peirce, R.F. Weiner, and P.A. Vesilind,Environmental Pollution and Control, 4th ed. (Stoneham, MA: Butterworth-Heinemann, 1998).

    Google Scholar 

  10. I. Saito, “Recovery of Valuable Metals from Printed Wiring Board Wastes,”Trans. Mater. Res. Soc. Jpn., 18A (1994), pp. 207–210.

    CAS  Google Scholar 

  11. J.A.S. Tenório, R.P. Menetti, and A.P. Chaves, “Production of Non-Ferrous Metallic Concentrates from Electronic Scrap,”EPD Congress, 1997, ed. B. Mishra (Warrendale, PA: TMS, 1997), pp. 505–509.

    Google Scholar 

  12. P.C. Hayes,Process Principles in Minerals and Materials Production (Hayes Publishing Co., 1993).

  13. G. Ferrara et al., “The Influence of Particle Shape on the Dynamic Dense Medium Separation of Plastics,”Int. J. Mineral Processing, 59 (2000), pp. 225–235.

    Article  CAS  Google Scholar 

Download references

Author information

Authors and Affiliations

Authors

Rights and permissions

Reprints and permissions

About this article

Cite this article

Veit, H.M., de Pereira, C.C. & Bernardes, A.M. Using mechanical processing in recycling printed wiring boards. JOM 54, 45–47 (2002). https://doi.org/10.1007/BF02701850

Download citation

  • Issue Date:

  • DOI: https://doi.org/10.1007/BF02701850

Keywords

Navigation