Abstract
A combination of macroscale solidification simulation and phase-field calculation is employed to predict solute segregation behavior during soldering using a Sn-Bi alloy. The solidification simulation predicts that the final solidified point appears at the edge of the fillet adjacent to the substrate side. The calculation incorporates the cooling rate in the phase-field simulation. The phase-field calculation suggests that microsegregation will not always lead to a thin liquid film at the solder/Cu-land interface and thus mechanical weakness.
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References
J.H. Vincent and G. Humpston, GEC J. Res. 11, 76 (1994).
K. Suganuma, Scripta Mater. 39, 1333 (1998).
K. Suganuma, M. Ueshima, I. Ohnaka, H. Yasuda, J. Zhu, and T. Matsuda, Acta Mater. 40, 4475 (2000).
K. Suganuma, Current Opinion Solid State Mater. Sci. 5, 55 (2001).
H. Takao and H. Hasegawa, J. Electron. Mater. 30, 1060 (2001).
W.J. Boettinger, C.A. Handwerker, B. Newbury, T.Y. Pan, and J.M. Nicholson, J. Electron. Mater. 31, 545 (2002).
W.J. Boettinger, J.A. Warren, C. Beckermann, and A. Karma, Ann. Rev. Mater. Res. 32, 163 (2002).
M. Ode, S.G. Kim, and T. Suzuki, ISIJ Int. 41, 1076 (2001).
M. Ode and T. Suzuki, ISIJ Int. 42, 368 (2002).
J.A. Warren and W.J. Boettinger, Acta Metall. Mater. 43, 689 (1995).
S.G. Kim, W.T. Kim, and T. Suzuki, Phys. Rev. E 60, 7186 (1999).
H. Ohtani and K. Ishida, J. Electron. Mater. 23, 747 (1994).
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Ode, M., Koyama, T., Onodera, H. et al. Phase-field modeling for Sn-Bi soldering. J. Electron. Mater. 32, 1534–1539 (2003). https://doi.org/10.1007/s11664-003-0126-y
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DOI: https://doi.org/10.1007/s11664-003-0126-y