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Thermal properties of Sn-based solder alloys

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Abstract

During last few decades, emerging environmental regulations worldwide, more notably in Europe and Japan, have targeted the elimination of Pb usage in electronic assemblies due to the inherent toxicity of this element. This situation drives to the replacement of the Sn–Pb solder alloy of eutectic composition commonly used as joining material to suitable lead-free solders for microelectronic assembly. Sn-based alloys containing Ag, Cu, Bi, and Zn are potential lead-free solders, usually close to the binary or ternary eutectic composition. For this reason a great effort was directed to establish reliable thermophysical data fundamental to interpret the solidification process and fluidity of alloys belonging to these systems. In this work, an analysis of the solidification process of pure Sn, binary Sn–Ag, Sn–Cu, Sn–Bi, Sn–Zn, Sn–Pb and ternary Sn–Ag–Cu eutectic alloys was carried out using computer aided-cooling curve analysis and differential scanning calorimetry.

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Acknowledgments

This work was carried out at CIFICEN (Centro de Investigaciones en Física e Ingeniería del Centro de la Provincia de Buenos Aires, CONICET-UNCPBA) and IFIMAT (Instituto de Física de Materiales Tandil, UNCPBA-CICPBA-MT) and has been partially supported by ANPCyT (Agencia Nacional de Promoción Científica y Tecnológica, CONICET (Consejo Nacional de Investigaciones Científicas y Técnicas, Av. Rivadavia 1917 (C1033AAJ) Buenos Aires, Argentina), SeCAT-UNCPBA (Secretaría de Ciencia, Arte y Tecnología de la Universidad Nacional del Centro de la Provincia de Buenos Aires) and CICPBA (Comisión de Investigaciones Científicas de la Provincia de Buenos Aires, Av 526 e/10 y 11 (B1906APP) La Plata, Argentina). CM and OF belong to CONICET, and OG and HP belong to CICPBA.

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Authors and Affiliations

  1. Instituto de Física de Materiales Tandil (IFIMAT), Centro de Investigación en Física e Ingeniería del Centro de la Provincia de Buenos Aires (CIFICEN), Universidad Nacional del Centro de la Provincia de Buenos Aires, Pinto 399, B7000GHG , Tandil, Argentina

    Carina Morando, Osvaldo Fornaro, Olga Garbellini & Hugo Palacio

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  1. Carina Morando
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  2. Osvaldo Fornaro
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  3. Olga Garbellini
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  4. Hugo Palacio
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Correspondence to Carina Morando.

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Morando, C., Fornaro, O., Garbellini, O. et al. Thermal properties of Sn-based solder alloys. J Mater Sci: Mater Electron 25, 3440–3447 (2014). https://doi.org/10.1007/s10854-014-2036-6

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  • DOI: https://doi.org/10.1007/s10854-014-2036-6

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