Skip to main content
SpringerLink
Log in

Least lead addition to mitigate tin whisker for ambient storage

  • Published:
Journal of Materials Science: Materials in Electronics Aims and scope Submit manuscript

Abstract

Long term surface evolution of matte tin electroplating has been investigated under room temperature to understand the tin whisker mitigation by a trace amount of lead addition. No whisker growth has been observed on all the Sn–xPb samples (1 ≤ x ≤ 10 wt%), while at least 3 wt% of Pb addition is required to alter the columnar grain structure of pure Sn plating to equiaxed grains. The mitigation mechanism by such a trace amount of Pb is not caused by the grain texture control, but is due to the less inter-metallic composite (IMC) growth; the segregated Pb at the columnar grain boundaries disrupts the IMC growth, and releases Sn grain boundary migrations to relax the internal stress. This mechanism of stress relaxation and whisker growth suppression suggests that lead-free Sn plating without whisker growth can be realized by co-plating Sn with a Pb-like metal element that precipitates at the grain boundary to interfere with the IMC growth.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8
Fig. 9
Fig. 10
Fig. 11
Fig. 12

Similar content being viewed by others

References

  1. H.P. Howard, J. Cheng, P.T. Vianco, J.C.M. Li, Acta Mater 59(10), 1957–1963 (2011)

    Article  CAS  Google Scholar 

  2. G.T. Galyon, in SMTAI U.S.A (2004), September 26-30, on SMTAI International conference (SMTAI): Chicago

  3. H.L. Cobb, Monthly Rev Amer Electroplaters Soc 33(28), 28–30 (1946)

    CAS  Google Scholar 

  4. K.G. Comptom, A. Mendizza, S.M. Arnold, Corrosion 7(10), 327–334 (1951)

    Google Scholar 

  5. B. Horváth, B. Illés, T. Shinohara, G. Harsányi, Thin Solid Films 520(17), 5733–5740 (2012)

    Article  Google Scholar 

  6. K. Suganuma, A. Baated, K.S. Kim, K. Hamasaki, N. Nemoto, T. Nakagawa, T. Yamada, Acta Mater 59, 7255–7267 (2011)

    Article  CAS  Google Scholar 

  7. W.J. Boettinger, C.E. Johnson, L.A. Bendersky, K.-W. Moon, M.E. Williams, G.R. Stafford, Acta Mater 53, 5033–5050 (2005)

    Article  CAS  Google Scholar 

  8. K.N. Tu, J.C.M. Li, Mater Sci Eng, A 409, 131–139 (2005)

    Article  Google Scholar 

  9. J.W. Osenbach, R.L. Shook, B.T. Vaccaro, B.D. Potteiger, A.N. Amin, K.N. Hooghan et al., IEEE Trans Electron Pack Manuf 28, 36 (2005)

    Article  CAS  Google Scholar 

  10. E. Chason, N. Jadhav, F. Pei, JOM 63(10), 62–68 (2011)

    Article  CAS  Google Scholar 

  11. N. Jadhav, J. Wasserman, F. Pei, E. Chason, J Electron Mater 41(3), 588–595 (2012)

    Article  CAS  Google Scholar 

  12. M. Sobiech, J. Teufel, U. Welzel, E.J. Mittemeijer, W. Hugel, J Electron Mater 40, 2300–2313 (2011)

    Article  CAS  Google Scholar 

  13. W. Zhang, F. Schwager, J. Elctrochem, Soc 153(5), C337–C343 (2006)

    CAS  Google Scholar 

Download references

Acknowledgments

This work was partially supported by Grant-in-Aid for Scientific Research (S) Grant Number 24226017.

Author information

Authors and Affiliations

  1. The Institute of Scientific and Industrial Research, Osaka University, Osaka, Japan

    Jung-Lae Jo, Tohru Sugahara, Shijo Nagao, Kyoko Hamasaki & Katsuaki Suganuma

  2. Fusion Technology Lab, Hoseo University, Asan, Korea

    Keun-Soo Kim

  3. R&D Division, C. Uyemura & Co., Ltd., Osaka, Japan

    Masanobu Tsujimoto

Authors
  1. Jung-Lae Jo
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Keun-Soo Kim
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Tohru Sugahara
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Shijo Nagao
    View author publications

    You can also search for this author in PubMed Google Scholar

  5. Kyoko Hamasaki
    View author publications

    You can also search for this author in PubMed Google Scholar

  6. Masanobu Tsujimoto
    View author publications

    You can also search for this author in PubMed Google Scholar

  7. Katsuaki Suganuma
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Jung-Lae Jo.

Rights and permissions

Reprints and permissions

About this article

Cite this article

Jo, JL., Kim, KS., Sugahara, T. et al. Least lead addition to mitigate tin whisker for ambient storage. J Mater Sci: Mater Electron 24, 3108–3115 (2013). https://doi.org/10.1007/s10854-013-1218-y

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s10854-013-1218-y

Keywords

Search

Navigation