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The bonding of nanowire assemblies using adhesive and solder

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Abstract

In the past decade, several strategies have been proposed to direct the assembly of nanocomponents from the bottom up to fabricate two- and three-dimensional integrated structures. In these strategies, either the surface or the bulk of a nanocomponent is functionalized to facilitate positive and negative interactions based on molecular, electrostatic, magnetic, or capillary forces, to enable the components to interact with one another in a fluidic medium and form thermodynamically stable structures. However, in many cases, the assembled structures are not well bonded. This paper summarizes results on directing the assembly of metallic rod-shaped (30–200 nm diameter) components with one another and with substrates to form structures that can be bonded by adhesive or solder. The methodology can be adapted with other self-assembling strategies to form mechanically stable, and in certain instances electrically conductive, assemblies composed of nanoscale componenents.

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Author information

Authors and Affiliations

  1. the Department of Chemical and Biomolecular Engineering at Johns Hopkins University, Baltimore, Maryland

    Zhiyong Gu (postdoctoral fellow), Hongke Ye (postdoctoral fellow) & David H. Gracias (assistant professor)

  2. the Department of Chemistry at Johns Hopkins University, USA

    David Gracias

Authors
  1. Zhiyong Gu
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  2. Hongke Ye
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  3. David H. Gracias
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  4. David Gracias
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Additional information

Editor’s Note: A hypertext-enhanced version of this article is available on-line at www.tms.org/pubs/journals/JOM/0512/Gu-0512.html.

For more information, contact David H. Gracias, Department of Chemical and Biomolecular Engineering and Department of Chemistry, Johns Hopkins University, 3400 N. Charles Street, Baltimore, MD 21218; (410) 516-5284, fax: (410) 516-5510, e-mail: dgracias@jhu.edu.

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Gu, Z., Ye, H., Gracias, D.H. et al. The bonding of nanowire assemblies using adhesive and solder. JOM 57, 60–64 (2005). https://doi.org/10.1007/s11837-005-0185-z

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