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Creep deformation characteristics of tin and tin-based electronic solder alloys

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Abstract

Creep deformation characteristics of pure tin, and Sn-3.5Ag and Sn-5Sb electronic solder alloys, have been studied at various temperatures between ambient and 473 K (homologous temperature 0.58 to 0.85). Power-law relationships between strain rate and stress were observed at most of the temperatures. The stress exponent (n=7.6, 5.0, and 5.0) and activation energy (Q c =60.3, 60.7, and 44.7 kJ/mol) values were obtained in the case of tin, Sn-3.5Ag, and Sn-5Sb respectively. Based on n and Q c values, it is suggested that the rate controlling creep-deformation mechanism is dislocation climb controlled by lattice diffusion in pure tin and Sn-3.5Ag alloy, and viscous glide controlled by pipe diffusion in Sn-5Sb alloy. The results on Sn-3.5Ag bulk material are compared with the initial results on solder bump arrays.

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Authors and Affiliations

  1. the Indira Gandhi Center for Atomic Research, 603 102, Kalpakkam, India

    M. D. Mathew (Senior Scientific Officer)

  2. AMCC, 92121, San Diego, CA

    H. Yang (Staff Reliability Engineer)

  3. Qualcomm CDMA Technologies, 92123, San Diego, CA

    S. Movva (Senior Packaging Engineer)

  4. North Carolina State University, 27695-7909, Raleigh, NC

    K. L. Murty (Nuclear Engineering Department and Materials Science & Engineering Department)

Authors
  1. M. D. Mathew
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  2. H. Yang
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  3. S. Movva
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  4. K. L. Murty
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Mathew, M.D., Yang, H., Movva, S. et al. Creep deformation characteristics of tin and tin-based electronic solder alloys. Metall Mater Trans A 36, 99–105 (2005). https://doi.org/10.1007/s11661-005-0142-z

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  • DOI: https://doi.org/10.1007/s11661-005-0142-z

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