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Contact improvement of carbon nanotubes via electroless nickel deposition

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Abstract

Individual multi-walled carbon nanotubes (CNTs) were deposited onto microelectrodes and embedded in nickel to achieve low-ohmic contact resistances. Electroless deposition of nickel onto gold/iron, palladium, and cobalt microelectrodes was used to form electrically stable bonds at the interfaces between the electrodes and CNTs. Resistance measurements showed that the contact resistances of the CNTs on gold/iron and palladium were significantly improved by nickel embedding, whereas no further improvement was found for the CNTs on cobalt. Electroless metal deposition is a parallel process providing stable electrical and mechanical contacts between CNTs and metallic microelectrodes.

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Correspondence to M. Liebau.

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81.07.De

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Liebau, M., Unger, E., Duesberg, G. et al. Contact improvement of carbon nanotubes via electroless nickel deposition. Appl Phys A 77, 731–734 (2003). https://doi.org/10.1007/s00339-003-2207-4

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  • DOI: https://doi.org/10.1007/s00339-003-2207-4

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