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Table of contents (8 chapters)
Keywords
About this book
Micromachined Ultrasound-Based Proximity Sensors describes a cost-effective approach to the realization of a micro electro mechanical system (MEMS). The micromachined silicon transducer elements were fabricated using industrial IC technology combined with standard silicon micromachining techniques. Additionally, this approach allows the cointegration of the driving and read-out circuitry. To ensure the industrial applicability of the fabricated transducer elements intensive long-term stability and reliability tests were performed under various environmental conditions such as high temperature and humidity.
Great effort was undertaken to investigate the packaging and housing of the ultrasound system, which mainly determine the success or failure of an industrial microsystem. A low-stress mounting of the transducer element minimizes thermomechanical stress influences. The developed housing not only protects the silicon chip but also improves the acoustic performance of the transducer elements.
The developed ultrasound proximity sensor system can determine object distances up to 10 cm with an accuracy of better than 0.8 mm.
Micromachined Ultrasound-Based Proximity Sensors will be of interest to MEMS researchers as well as those involved in solid-state sensor development.
Authors and Affiliations
Bibliographic Information
Book Title: Micromachined Ultrasound-Based Proximity Sensors
Authors: Mark R. Hornung, Oliver Brand
Series Title: Microsystems
DOI: https://doi.org/10.1007/978-1-4615-4997-0
Publisher: Springer New York, NY
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eBook Packages: Springer Book Archive
Copyright Information: Springer Science+Business Media New York 1999
Hardcover ISBN: 978-0-7923-8508-0Published: 30 April 1999
Softcover ISBN: 978-1-4613-7269-1Published: 08 October 2012
eBook ISBN: 978-1-4615-4997-0Published: 06 December 2012
Series ISSN: 1389-2134
Edition Number: 1
Number of Pages: XIII, 121
Topics: Electrical Engineering, Optical and Electronic Materials