Abstract
Mesaelements of the focal plane array (FPA) of p–i–n diodes based on Al x Ga1–x N for p–i–n heteroepitaxial structures (HESs) grown by the molecular-beam epitaxy and hydride epitaxy methods with the use of metalorganic compounds are formed. Elements of 320 × 256 FPAs with a pitch of 30 μm are separated by means of ion-beam etching through a photoresist mask in the argon ion stream produced by the Kaufmann ion source in a vacuum plant. To determine the required etching depth, contact profilometry and ultraviolet spectrophotometry methods allowing one to determine positions of the n-layer and sufficient etching depth of the sample are used. The thickness accuracy of the HES functional layers stated in manufacturer’s certificates does not exceed 28%. Rates of ion-beam etching of Al x Ga1–x N for p–i–n layers with different compositions are determined.
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Original Russian Text © D.V. Smirnov, K.O. Boltar, M.V. Sednev, Yu.P. Sharonov, 2015, published in Prikladnaya Fizika, 2015, No. 4, pp. 66–71.
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Smirnov, D.V., Boltar, K.O., Sednev, M.V. et al. Characteristics of heteroepitaxial structures Al x Ga1–x N for p–i–n diode focal plane arrays. J. Commun. Technol. Electron. 61, 358–362 (2016). https://doi.org/10.1134/S1064226916030189
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DOI: https://doi.org/10.1134/S1064226916030189