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Molecular simulation study on adhesions and deformations for Polymethyl Methacrylate (PMMA) resist in nanoimprint lithography

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Abstract

The NIL (nanoimprint lithography) process is explored through numerical simulation, utilizing MD (molecular dynamics), with a focus on the resin deformations and the adhesion between the resin material and the tool. For the force-field of the Polymethyl Methacrylate (PMMA), used for the resin material, a united atom model is employed. For temperature control in the MD simulation, the recursive multiple chains of the Nosé-Poincaré thermostat is applied. The deformation and adhesion in the NIL process are explored from the mechanics viewpoint based on the present MD results. In particular, the adhesion behavior of a self-assembly monolayer (SAM) in the stamp-releasing stage is discussed in connection with the monolayer thickness.

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Authors and Affiliations

  1. Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Science Town, Daejeon, 305-701, Korea

    Sungjin Kwon, Youngmin Lee, Jaeshin Park & Seyoung Im

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  1. Sungjin Kwon
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  2. Youngmin Lee
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  4. Seyoung Im
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Correspondence to Seyoung Im.

Additional information

This paper was recommended for publication in revised form by Editor Maenghyo Cho

Seyoung Im received B.S. (1976) of mechanical engineering from Seoul National University, Korea and Ph.D (1985) degree of theoretical and applied mechanics from University of Illinois at Urbana-Champaign, USA. He is currently a professor at the department of mechanical engineering in Korea Advanced Institute of Science and Technology (KAIST). His current interests are computational nanotechnology and multiphysics.

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Kwon, S., Lee, Y., Park, J. et al. Molecular simulation study on adhesions and deformations for Polymethyl Methacrylate (PMMA) resist in nanoimprint lithography. J Mech Sci Technol 25, 2311–2322 (2011). https://doi.org/10.1007/s12206-011-0709-0

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  • DOI: https://doi.org/10.1007/s12206-011-0709-0

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