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Thermal and Moisture Stresses in Plastic Packages

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Thermal Stress and Strain in Microelectronics Packaging

Abstract

Increased package density and reliability expectations require a better understanding of the mechanical behavior of plastic packages under process and use conditions. This chapter reviews potential failure modes and a combined analytical/experimental approach developed under ESPRIT project 5033—PLASIC for stress analysis in plastic packages. This includes (1) a failure criterion for moisture-induced stresses; (2) a finite-element approach for thermal stress analysis; and (3) a piezoresistive technique for stress measurements and model calibration. The latter is applied to the particular problem of metal line displacement at the surface of a silicon die.

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Authors
  1. Michel Mermet-Guyennet
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Editors and Affiliations

  1. Hewlett-Packard Company, Palo Alto, California, USA

    John H. Lau PhD, PE

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© 1993 Van Nostrand Reinhold

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Mermet-Guyennet, M. (1993). Thermal and Moisture Stresses in Plastic Packages. In: Lau, J.H. (eds) Thermal Stress and Strain in Microelectronics Packaging. Springer, Boston, MA. https://doi.org/10.1007/978-1-4684-7767-2_13

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  • DOI: https://doi.org/10.1007/978-1-4684-7767-2_13

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4684-7769-6

  • Online ISBN: 978-1-4684-7767-2

  • eBook Packages: Springer Book Archive

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