Abstract
Surface mount technology (SMT) has been widely adopted in recent years, brought on by the need to produce small, dense electronic packaging. This technology has many advantageous characteristics:
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SMT allows for components to be mounted on both sides of the board.
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Holes through the board are only needed for communication between the surface and the circuit planes; thus the size of the holes can be decreased.
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Since less room is needed for holes, a 50 percent increase in line density from a similar through-hole board can be obtained.’
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Kilinski, T.J., Lesniak, J.R., Sandor, B.I. (1991). Modern Approaches to Fatigue Life Prediction of SMT Solder Joints. In: Lau, J.H. (eds) Solder Joint Reliability. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-3910-0_13
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DOI: https://doi.org/10.1007/978-1-4615-3910-0_13
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